TA = 25°C, unless otherwise note" />
參數(shù)資料
型號: AD5378ABCZ
廠商: Analog Devices Inc
文件頁數(shù): 4/29頁
文件大?。?/td> 0K
描述: IC DAC 14BIT 32CHAN 108CSPBGA
產(chǎn)品培訓模塊: Data Converter Fundamentals
DAC Architectures
標準包裝: 1
設置時間: 20µs
位數(shù): 14
數(shù)據(jù)接口: 串行,并聯(lián)
轉換器數(shù)目: 32
電壓電源: 模擬和數(shù)字,雙 ±
功率耗散(最大): 850mW
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 108-BGA,CSPBGA
供應商設備封裝: 108-CSPBGA(13x13)
包裝: 托盤
輸出數(shù)目和類型: 32 電壓,雙極
采樣率(每秒): 50k
AD5378
Rev. A | Page 11 of 28
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Transient currents of up to 100 mA do not cause SCR latch-up.
Table 7.
Parameter
Rating
VDD to AGND
0.3 V to +17 V
VSS to AGND
17 V to +0.3 V
VCC to DGND
0.3 V to +7 V
Digital Inputs to DGND
0.3 V to VCC + 0.3 V
Digital Outputs to DGND
0.3 V to VCC + 0.3 V
VREF1(+), VREF2(+) to AGND
0.3 V to +7 V
VREF1(), VREF2() to AGND
VSS 0.3 V to VDD + 0.3 V
VBIAS to AGND
0.3 V to +7 V
VOUT0–VOUT31 to AGND
VSS 0.3 V to VDD + 0.3 V
REFGND to AGND
VSS 0.3 V to VDD + 0.3 V
AGND to DGND
0.3 V to +0.3 V
Operating Temperature Range (TA)
Industrial (A Version)
40°C to +85°C
Storage Temperature Range
65°C to +150°C
Junction Temperature (TJ max)
150°C
108-Lead CSPBGA Package
θJA Thermal Impedance
37.5°C/W
θJC Thermal Impedance
8.5°C/W
Reflow Soldering
Peak Temperature
230°C
Time at Peak Temperature
10 sec to 40 sec
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability. Only one absolute maximum rating may be
applied at any one time.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
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