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參數(shù)資料
| 型號： | 935263011112 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 通信及網(wǎng)絡 |
| 英文描述： | SPECIALTY TELECOM CIRCUIT, PDSO16 |
| 封裝： | PLASTIC, SOT-162, SO-16 |
| 文件頁數(shù)： | 19/33頁 |
| 文件大?。?/td> | 574K |
| 代理商： | 935263011112 |
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Philips Semiconductors
PCD3316
CIDCW receiver
Product specication
11 March 1999
26 of 30
9397 750 04824
Philips Electronics N.V. 1999. All rights reserved.
Unrestr
icted
Typical dwell time is 4 seconds at 250
°C. A mildly-activated ux will eliminate the
need for removal of corrosive residues in most applications.
13.4 Manual soldering
Fix the component by rst soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the at part of the lead. Contact time
must be limited to 10 seconds at up to 300
°C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320
°C.
13.5 Package related soldering information
[1]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the
Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods.
[2]
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board
and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top
version).
[3]
If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[4]
Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger
than 0.8 mm; it is denitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[5]
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is denitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Table 19: Suitability of surface mount IC packages for wave and reow soldering
methods
Package
Soldering method
Wave
Reow [1]
BGA, SQFP
not suitable
suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS
not suitable [2]
suitable
PLCC, SO, SOJ
suitable
LQFP, QFP, TQFP
suitable
SSOP, TSSOP, VSO
not recommended [5]
suitable
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