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參數(shù)資料
| 型號： | 935263011112 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 通信及網(wǎng)絡(luò) |
| 英文描述： | SPECIALTY TELECOM CIRCUIT, PDSO16 |
| 封裝： | PLASTIC, SOT-162, SO-16 |
| 文件頁數(shù)： | 18/33頁 |
| 文件大?。?/td> | 574K |
| 代理商： | 935263011112 |
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Philips Semiconductors
PCD3316
CIDCW receiver
Product specication
11 March 1999
25 of 30
9397 750 04824
Philips Electronics N.V. 1999. All rights reserved.
Unrestr
icted
13. Soldering
13.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our
Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering is not always suitable for surface mount ICs, or for printed-circuit boards
with high population densities. In these situations reow soldering is often used.
13.2 Reow soldering
Reow soldering requires solder paste (a suspension of ne solder particles, ux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement.
Several methods exist for reowing; for example, infrared/convection heating in a
conveyor type oven. Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating method.
Typical reow peak temperatures range from 215 to 250
°C. The top-surface
temperature of the packages should preferable be kept below 230
°C.
13.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specically
developed.
If wave soldering is used the following conditions must be observed for optimal
results:
Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45° angle
to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be xed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
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