參數(shù)資料
型號(hào): 908E624
廠商: Motorola, Inc.
英文描述: TRIPLE HIGH-SIDE SWITCH WITH EMBEDDED MCU AND LIN
中文描述: 三重高邊開(kāi)關(guān)與嵌入式微控制器和LIN
文件頁(yè)數(shù): 30/32頁(yè)
文件大?。?/td> 453K
代理商: 908E624
Analog Integrated Circuit Device Data
Freescale Semiconductor
32
908E624DW
Figure 1. Thermal Test Board
Device on Thermal Test Board
R
θ
JA
mn
is the thermal resistance between die junction and
ambient air.
This device is a dual die package. Index
m
indicates the die
that is heated. Index
n
refers to the number of the die where
the junction temperature is sensed.
908E624 Terminal Connections
54-Terminal SOICW
0.65 mm Pitch
17.9 mm x 7.5 mm Body
PTA0/KBD0
PTA1/KBD1
PTA2/KBD2
FLSVPP
PTA3/KBD3
PTA4/KBD4
VREFH
VDDA
EVDD
EVSS
VSSA
VREFL
PTE1/RXD
NC
RXD
WDCONF
+E
-E
OUT
VCC
AGND
VDD
NC
VSUP1
GND
LIN
VSUP2
PTB7/AD7/TBCH1
PTB6/AD6/TBCH0
PTC4/OSC1
PTC3/OSC2
PTC2/MCLK
PTB5/AD5
PTB4/AD4
PTB3/AD3
IRQ
RST
PTB1/AD1
PTD0/TACH0
PTD1/TACH1
NC
NC
NC
PWMIN
RST_A
IRQ_A
NC
NC
NC
L1
L2
HS3
HS2
HS1
1
2
3
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
9
10
6
7
8
4
5
54
53
52
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
46
45
49
48
47
51
50
A
Material:
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
Outline:
80 mm x 100 mm board area,
including edge connector for thermal
testing
Area
A
:
Cu heat-spreading areas on board
surface
Ambient Conditions:
Natural convection, still air
Table 2.
Thermal Resistance Performance
Terminal
Resistance
Area A
(mm
2
)
1 = Power Chip, 2 = Logic Chip (
°
C/W)
m
= 1,
n
= 1
m
= 1, n = 2
m
= 2, n = 1
m
= 2,
n
= 2
R
θ
JA
mn
0
58
48
53
300
56
46
51
600
54
45
50
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