參數(shù)資料
型號(hào): 71V3557SA85BG8
廠商: INTEGRATED DEVICE TECHNOLOGY INC
元件分類: SRAM
英文描述: 128K X 36 ZBT SRAM, 8.5 ns, PBGA119
封裝: 14 X 22 MM, POWER, PLASTIC, BGA-119
文件頁(yè)數(shù): 13/28頁(yè)
文件大?。?/td> 511K
代理商: 71V3557SA85BG8
6.42
20
IDT71V3557, IDT71V3559, 128K x 36, 256K x 18, 3.3V Synchronous SRAMs with
ZBT Feature, 3.3V I/O, Burst Counter, and Flow-Through Outputs
Commercial and Industrial Temperature Ranges
Timing Waveform of CEN Operation (1,2,3,4)
NOTES:
1.
Q
(A
1)
represents
the
first
output
from
the
external
address
A
1.
D
(A
2)
represents
the
input
data
to
the
SRAM
corresponding
to
address
A
2.
2.
C
E
2timing
transitions
are
identical
but
inverted
to
the
CE
1and
CE
2
signals.
For
example,
when
CE
1and
CE
2are
LOW
on
this
waveform,
CE
2is
HIGH.
3.
CEN
when
sampled
high
on
the
rising
edge
of
clock
will
block
that
L-H
transition
of
the
clock
from
propogating
into
the
SRAM.
The
part
will
behave
as
if
the
L-H
clock
transition
did
not
occur.
All
internal
registers
in
the
SRAM
will
retain
their
previous
state.
4.
Individual
Byte
Write
signals
(BW
x)
must
be
valid
on
all
write
and
burst-write
cycles.
A
write
cycle
is
initiated
when
R/
W
signal
is
sampled
LOW.
The
byte
write
information
comes
in
one
cycle
before
the
actual
data
is
presented
to
the
SRAM.
tH
E
tS
E
R
/W
A
1
A
2
C
LK
C
E
N
A
D
V
/LD
A
D
R
E
S
C
E
1
,
C
E
2
(2
)
B
W
1
-
B
W
4
O
E
D
A
T
A
O
U
T
Q
(A
1
)
tC
D
C
Q
(A
3
)
tC
D
tC
LZ
Q
(A
1
)
Q
(A
4
)
tC
D
tC
D
C
tC
H
Z
D
(A
2
)
tS
D
tH
D
tC
H
tC
L
tC
Y
C
tH
C
tS
C
A
4
A
5
tH
A
D
V
tS
A
D
V
tH
W
tS
W
tH
A
tS
A
3
tH
B
tS
B
D
A
T
A
IN
52
82
dr
w
09
B
(A
2
)
.
,
相關(guān)PDF資料
PDF描述
71V67703S75BQ 256K X 36 CACHE SRAM, 7.5 ns, PBGA165
72-30-33 0 MHz - 4000 MHz RF/MICROWAVE FIXED ATTENUATOR
72-40-43 0 MHz - 4000 MHz RF/MICROWAVE FIXED ATTENUATOR
72-10-14 0 MHz - 4000 MHz RF/MICROWAVE FIXED ATTENUATOR
72-30-13 0 MHz - 4000 MHz RF/MICROWAVE FIXED ATTENUATOR
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
71V3558S100PFG 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
71V3558S100PFG8 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
71V3558S100PFGI 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
71V3558S100PFGI8 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
71V3558S133BG 制造商:Integrated Device Technology Inc 功能描述:4.5MBIT SRAM CHIP SYNC SINGLE 3.3V 256K X 18 4.2NS - Trays 制造商:Integrated Device Technology Inc 功能描述:IDT 71V3558S133BG, 4.5MBit SRAM Chip Sync Single 3.3V 256K x 18 4.2ns 119-Pin BGA