
E
28F160S3/28F320S3
13
PRELIMINARY
Table 2. Bus Operations
Mode
Notes
RP#
CE
0
#
CE
1
# OE#
(11)
WE#
(11)
Address
V
PP
DQ
(8)
STS
(3)
Read
1,2
V
IH
V
IL
V
IL
V
IL
V
IH
X
X
D
OUT
X
Output Disable
V
IH
V
IL
V
IL
V
IH
V
IH
X
X
High Z
X
Standby
V
IH
V
IL
V
IH
V
IH
V
IH
V
IL
V
IH
X
X
X
X
High Z
X
Reset/Power-
Down Mode
10
V
IL
X
X
X
X
X
X
High Z High Z
(9)
Read Identifier
Codes
4
V
IH
V
IL
V
IL
V
IL
V
IH
See
Figure 5
X
D
OUT
High Z
(9)
Read Query
5
V
IH
V
IL
V
IL
V
IL
V
IH
See Table 6
X
D
OUT
High Z
(9)
Write
3,6,7
V
IH
V
IL
V
IL
V
IH
V
IL
X
V
PPH1/2/3
D
IN
X
NOTES:
1. Refer to DC Characteristics When V
PP
≤
 V
PPLK
, memory contents can be read, but not altered.
2. X can be V
IL
 or V
IH
 for control and address input pins and V
PPLK
 or V
PPH1/2/3
 for V
PP
. See Section 6.4, DC Characteristics
for V
PPLK
 and V
PPH1/2/3
 voltages.
3. STS in level RY/BY# mode (default) is V
OL
 when the WSM is executing internal block erase, programming, or lock-bit
configuration algorithms. It is V
OH
 when the WSM is not busy, in block erase suspend mode (with programming inactive),
program suspend mode, or deep power-down mode.
4. See Section 4.3 for read identifier code data.
5. See Section 4.2 for read query data.
6. Command writes involving block erase, write, or lock-bit configuration are reliably executed when V
PP
 = V
PPH1/2/3
 and
V
CC
 = V
CC1/2
 (see Section 6.2).
7. Refer to Table 3 for valid D
IN
 during a write operation.
8. DQ refers to DQ
0
–7
 if BYTE# is low and DQ
0–15
 if BYTE# is high.
9. High Z will be V
OH
 with an external pull-up resistor.
10. 
RP# at GND ± 0.2 V ensures the lowest deep power-down current.
11. OE# = V
IL
 and WE# = V
IL
 concurrently is an undefined state and should not be attempted.