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參數(shù)資料
| 型號： | μPD78P048A |
| 廠商： | NEC Corp. |
| 英文描述： | 8 Bit Single Chip Microcontrollers(8位單片微控制器) |
| 中文描述： | 8位單片機微控制器（8位單片微控制器） |
| 文件頁數(shù)： | 63/72頁 |
| 文件大小： | 387K |
| 代理商： | ΜPD78P048A |
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m
PD78P048A
63
12. RECOMMENDED SOLDERING CONDITIONS
The conditions listed below shall be met when soldering the
m
PD78P048A.
For details of the recommended soldering conditions, refer to our information document
Semiconductor Device
Mounting Technology Manual (C10535E)
.
Please consult with our sales offices in case any other soldering process is used, or in case soldering is done under
different conditions.
Table 12-1. Soldering Conditions for Surface-Mount Type
m
PD78P048AGF-3B9: 80-pin plastic QFP (14
￥
20 mm)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235 °C, Duration: 30 sec. max. (at 210 °C or above),
Number of times: Thrice max.
IR35-00-3
VPS
Package peak temperature: 215 °C, Duration: 40 sec. max. (at 200 °C or above),
Number of times: Thrice max.
VP15-00-3
Wave soldering
Solder bath temperature: 260 °C max. Duration: 10 sec. max.
Number of times: Once
Preliminary heat temperature: 120 °C max. (Package surface temperature)
WS60-00-1
Partial heating
Pin temperature: 300 °C max., Duration: 3 sec. max. (per device side)
—
Caution Using more than one soldering method should be avoided (except in the case of partial heating).
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