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參數(shù)資料
| 型號： | μPD78P048A |
| 廠商： | NEC Corp. |
| 英文描述： | 8 Bit Single Chip Microcontrollers(8位單片微控制器) |
| 中文描述： | 8位單片機微控制器（8位單片微控制器） |
| 文件頁數(shù)： | 10/72頁 |
| 文件大小： | 387K |
| 代理商： | ΜPD78P048A |
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m
PD78P048A
10
CONTENTS
1.
DIFFERENCES BETWEEN
m
PD78P048A AND MASK ROM PRODUCTS ...................................
11
2.
PIN FUNCTION ...............................................................................................................................
2.1
Pins in Normal Operating Mode .........................................................................................................
2.2
Pins in PROM Programming Mode ....................................................................................................
2.3
Pin Input/Output Circuits and Recommended Connection of Unused Pins ..................................
12
12
15
16
3.
MEMORY SIZE SWITCHING REGISTER (IMS) .............................................................................
19
4.
INTERNAL EXPANSION RAM SIZE SWITCHING REGISTER (IXS).............................................
20
5.
PROM PROGRAMMING .................................................................................................................
5.1
Operating Modes .................................................................................................................................
5.2
PROM Write Procedure .......................................................................................................................
5.3
PROM Read Procedure .......................................................................................................................
21
21
23
27
6.
ERASURE METHOD (
m
PD78P048AKL-S ONLY) ..........................................................................
28
7.
ERASURE WINDOW SEAL (
m
PD78P048AKL-S ONLY)................................................................
28
8.
ONE-TIME PROM PRODUCTS SCREENING ................................................................................
28
9.
ELECTRICAL SPECIFICATIONS ...................................................................................................
29
10. CHARACTERISTIC CURVE (REFERENCE VALUE) .....................................................................
56
11. PACKAGE DRAWINGS ..................................................................................................................
61
12. RECOMMENDED SOLDERING CONDITIONS ..............................................................................
63
APPENDIX A. DEVELOPMENT TOOLS ..............................................................................................
64
APPENDIX B. RELATED DOCUMENTS .............................................................................................
68
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