415
APPENDIX A DIFFERENCES BETWEEN
μ
PD78014H, 78018F, 780024,
AND 780034 SUBSERIES
Table A-1 shows the major differences between
μ
PD78014H, 78018F, 780024, and 780034 Subseries.
Table A-1. Major Differences between
μ
PD78014H, 78018F, 780024, and 780034 Subseries
Name
μ
PD78014H Subseries
μ
PD78018F Subseries
μ
PD780024, 780034
Subseries
Items
Anti-EMI noise measure
Provided
None
Provided
Internal I
2
C bus version
(Y subseries)
None
Exist
Exist (multimaster
supported)
PROM (flash memory) version
μ
PD78P018F
μ
PD78F0034
Power supply voltage
V
DD
= 1.8 to 5.5 V
Internal high-speed RAM size
512 bytes
μ
PD78011H, 78012H
1024 bytes
μ
PD78013H, 78014H
512 bytes
μ
PD78011F, 78012F
1024 bytes
μ
PD78013F, 78014F
μ
PD78015F, 78016F
μ
PD78018F
512 bytes
μ
PD780021/31
μ
PD780022/32
1024 bytes
μ
PD780023/33
μ
PD780024/34
Internal expansion RAM size
None
512 bytes
μ
PD78015F, 78016F
1024 bytes
μ
PD78018F
None
MIN. instruction execution time
0.4
μ
s (10 MHz)
0.24
μ
s (8.38 MHz)
Number of I/O port
53
51
A/D converter
8 bits
×
8
8 bits
×
8
10 bits
×
8 (
μ
PD780034
Subseries)
Operation
mode of
Subseries other
than Y series
3-wire/2-wire/SBI: 1
3-wire (automatic transmit and receive): 1
3-wire : 2, UART: 1
serial
interface
Y subseries
—
3-wire/2-wire/I
2
C: 1
3-wire (automatic
transmit and receive): 1
3-wire : 1, UART: 1,
multimaster I
2
C: 1
Package
64-pin plastic shrink DIP (750 mils)
64-pin plastic QFP (14
×
14 mm)
64-pin plastic
LQFP (12
×
12 mm)
64-pin ceramic shrink
DIP (with window)
(750 mils)
Note
64-pin ceramic WQFN
(14
×
14 mm)
Note
64-pin plastic
LQFP (12
×
12 mm)
Programmer adapter
PA-78P018CW, PA-78P018GC,
PA-78P018GK, PA-78P018KK-S
The development tool
system differs from other
Emulation board
IE-78014-R-EM-A
subseries.
Electric specifications
Recommended soldering
conditions
Refer to the data sheet of each product.
Note
Only for PROM version