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參數(shù)資料
| 型號(hào)： | XRT73LC04AIV |
| 廠商： | Exar Corporation |
| 文件頁(yè)數(shù)： | 29/64頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC LIU E3/DS3/STS-1 4CH 144LQFP |
| 標(biāo)準(zhǔn)包裝： | 60 |
| 類型： | 線路接口裝置（LIU） |
| 驅(qū)動(dòng)器/接收器數(shù)： | 4/4 |
| 規(guī)程： | DS3，E3，STS-1 |
| 電源電壓： | 3.135 V ~ 3.465 V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 144-LQFP |
| 供應(yīng)商設(shè)備封裝： | 144-LQFP（20x20） |
| 包裝： | 托盤 |
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XRT73LC04A
31
REV. 1.0.2
4 CHANNEL DS3/E3/STS-1 LINE INTERFACE UNIT
a. Operating in the HOST Mode.
When the XRT73LC04A is operating in the HOST
Mode, then the HDB3/B3ZS Encoders within each
channel can be individually enabled or disabled. Dis-
able the HDB3/B3ZS Encoder block within Chan-
nel(n) by setting the (SR/DR)_(n) bit-field within Com-
mand Register (CR3-(n)) to "1" as illustrated below.
NOTE: This method can only be used if the XRT73LC04A is
operating in the HOST Mode.
If either of these methods are used to disable the
HDB3/B3ZS Encoder, then the LIU transmits the data
as received via the TPData_(n) and TNData_(n) input
pins.
2.4
THE TRANSMIT PULSE SHAPING CIRCUITRY
The Transmit Pulse Shaper Circuitry consists of a
Transmit Line Build-Out circuit which can be enabled
or disabled by setting the TxLEV_(n) input pin or
TxLEV_(n) bit-field to “High”or "Low". The purpose of
the Transmit Line Build-Out circuit is to permit config-
uration of each channel to transmit an output pulse
which is compliant to either of the following pulse
template requirements when measured at the Digital
Cross Connect System. Each of these Bellcore spec-
ifications state that the cable length between the
Transmit Output and the Digital Cross Connect sys-
tem can range anywhere from 0 to 450 feet.
The Isolated DSX-3 Pulse Template Requirement per
Bellcore GR-499-CORE is illustrated in Figure 19 and
the Isolated STSX-1 Pulse Template Requirement
per Bellcore GR-253-CORE is illustrated in Figure 20.
COMMAND REGISTER CR3-(n)
D4
D3
D2
D1
D0
(SR/DR)_(n)
LOSMUT_(n)
RxOFF
RxClk_(n)INV
Reserved
1
X
FIGURE 19. THE BELLCORE GR-499-CORE TRANSMIT OUTPUT PULSE TEMPLATE FOR DS3 APPLICATIONS
D S 3 P u lse T em p late
-0.2
0
0.2
0.4
0.6
0.8
1
1.2
-1
-0
.9
-0
.8
-0
.7
-0
.6
-0
.5
-0
.4
-0
.3
-0
.2
-0
.1
0
0.
1
0.
2
0.
3
0.
4
0.
5
0.
6
0.
7
0.
8
0.
9
1
1.
1
1.
2
1.
3
1.
4
Tim e , in UI
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Lower Curve
Upper Curve
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| XRT73LC04AIV-F | 功能描述:外圍驅(qū)動(dòng)器與原件 - PCI 4-Ch DS3, E3, STS-1 RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray |
| XRT73R06 | 制造商:EXAR 制造商全稱:EXAR 功能描述:SIX CHANNEL E3/DS3/STS-1 LINE INTERFACE UNIT |
| XRT73R06ES | 功能描述:網(wǎng)絡(luò)控制器與處理器 IC RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
| XRT73R06IB | 功能描述:外圍驅(qū)動(dòng)器與原件 - PCI RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray |
| XRT73R06IB-F | 功能描述:外圍驅(qū)動(dòng)器與原件 - PCI RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray |
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