參數(shù)資料
型號(hào)： XPC862
廠商： Motorola, Inc.
英文描述： Hardware Specifications
中文描述： 硬件規(guī)格
文件頁數(shù)： 9/88頁
文件大?。?/td> 483K
代理商： XPC862
MOTOROLA
MPC862/857T/857DSL Hardware Specifications
For More Information On This Product,
Go to: www.freescale.com
9
Thermal Characteristics
4
Thermal Characteristics
Table 3 shows the thermal characteristics for the MPC862/857T/857DSL.
Table 3. MPC862/857T/857DSL Thermal Resistance Data
Rating
Environment
Symbol
Value
Unit
Junction to ambient
1
1
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board,
and board thermal resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature
is measured on the top surface of the board near the package.
Indicates the average thermal resistance between the die and the case top surface as measured by the cold
plate method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case
temperature. For exposed pad packages where the pad would be expected to be soldered, junction to case
thermal resistance is a simulated value from the junction to the exposed pad without contact resistance.
Thermal characterization parameter indicating the temperature difference between package top and the
junction temperature per JEDEC JESD51-2.
Natural Convection
Single layer board (1s)
R
θ
JMA 3
JA 2
2
37
°C/W
Four layer board (2s2p)
R
θ
3
23
Air flow (200 ft/min)
Single layer board (1s)
R
θ
JMA3
30
Four layer board (2s2p)
R
θ
JMA3
19
Junction to board
4
4
R
θ
JB
13
Junction to case
5
5
R
θ
JC
6
Junction to package top
6
6
Natural Convection
Ψ
JT
2
Air flow (200 ft/min)
Ψ
JT
2
F
Freescale Semiconductor, Inc.
n
.
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