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參數(shù)資料
| 型號： | XPC862 |
| 廠商： | Motorola, Inc. |
| 英文描述： | Hardware Specifications |
| 中文描述： | 硬件規(guī)格 |
| 文件頁數(shù)： | 15/88頁 |
| 文件大?。?/td> | 483K |
| 代理商： | XPC862 |
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MOTOROLA
MPC862/857T/857DSL Hardware Specifications
For More Information On This Product,
Go to: www.freescale.com
15
Layout Practices
1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an Automotive
Engine Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47-54.
2. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance and Its
Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp. 212-220.
8
Layout Practices
Each V
CC
pin on the MPC862/857T/857DSL should be provided with a low-impedance path to the board’s
supply. Each GND pin should likewise be provided with a low-impedance path to ground. The power supply
pins drive distinct groups of logic on chip. The V
CC
power supply should be bypassed to ground using at
least four 0.1 μF by-pass capacitors located as close as possible to the four sides of the package. The
capacitor leads and associated printed circuit traces connecting to chip V
CC
and GND should be kept to less
than half an inch per capacitor lead. A four-layer board is recommended, employing two inner layers as V
CC
and GND planes.
All output pins on the MPC862/857T/857DSL have fast rise and fall times. Printed circuit (PC) trace
interconnection length should be minimized in order to minimize undershoot and reflections caused by these
fast output switching times. This recommendation particularly applies to the address and data busses.
Maximum PC trace lengths of six inches are recommended. Capacitance calculations should consider all
device loads as well as parasitic capacitances due to the PC traces. Attention to proper PCB layout and
bypassing becomes especially critical in systems with higher capacitive loads because these loads create
higher transient currents in the V
CC
and GND circuits. Pull up all unused inputs or signals that will be inputs
during reset. Special care should be taken to minimize the noise levels on the PLL supply pins.
9
Bus Signal Timing
The maximum bus speed supported by the MPC862/857T/857DSL is 66 MHz. Higher-speed parts must be
operated in half-speed bus mode (for example, an MPC862/857T/857DSL used at 80MHz must be
configured for a 40 MHz bus). Table 6 shows the period ranges for standard part frequencies.
Table 7 provides the bus operation timing for the MPC862/857T/857DSL at 33 MHz, 40 Mhz, 50 MHz and
66 Mhz.
The timing for the MPC862/857T/857DSL bus shown assumes a 50-pF load for maximum delays and a
0-pF load for minimum delays.
Table 6. Period Range for Standard Part Frequencies
Freq
50 MHz
66 MHz
80 MHz
100 MHz
Min
Max
Min
Max
Min
Max
Min
Max
Period
20.00
30.30
15.15
30.30
25.00
30.30
20.00
30.30
F
Freescale Semiconductor, Inc.
n
.
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