參數(shù)資料
型號: XC3S1000-4FG676I
廠商: XILINX INC
元件分類: FPGA
英文描述: Spartan-3 FPGA Family : Complete Data Sheet
中文描述: FPGA, 1920 CLBS, 1000000 GATES, 630 MHz, PBGA676
封裝: 27 X 27 MM, FBGA-676
文件頁數(shù): 8/192頁
文件大?。?/td> 1555K
代理商: XC3S1000-4FG676I
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DS099-2 (v1.2) July 11, 2003
Advance Product Specification
www.xilinx.com
1-800-255-7778
1
2003 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at
http://www.xilinx.com/legal.htm
.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
IOBs
IOB Overview
The Input/Output Block (IOB) provides a programmable,
bidirectional interface between an I/O pin and the FPGA’s
internal logic.
A simplified diagram of the IOB’s internal structure appears
in
Figure 1
. There are three main signal paths within the
IOB: the output path, input path, and 3-state path. Each
path has its own pair of storage elements that can act as
either registers or latches. For more information, see the
Storage Element Functions section. The three main signal
paths are as follows:
The input path carries data from the pad, which is
bonded to a package pin, through an optional
programmable delay element directly to the I line. After
the delay element, there are alternate routes through a
pair of storage elements to the IQ1 and IQ2 lines. The
IOB outputs I, IQ1, and IQ2 all lead to the FPGA’s
internal logic. The delay element can be set to ensure a
hold time of zero.
The output path, starting with the O1 and O2 lines,
carries data from the FPGA’s internal logic through a
multiplexer and then a three-state driver to the IOB
pad. In addition to this direct path, the multiplexer
provides the option to insert a pair of storage elements.
The 3-state path determines when the output driver is
high impedance. The T1 and T2 lines carry data from
the FPGA’s internal logic through a multiplexer to the
output driver. In addition to this direct path, the
multiplexer provides the option to insert a pair of
storage elements.
All signal paths entering the IOB, including those
associated with the storage elements, have an inverter
option. Any inverter placed on these paths is
automatically absorbed into the IOB.
Storage Element Functions
There are three pairs of storage elements in each IOB, one
pair for each of the three paths. It is possible to configure
each of these storage elements as an edge-triggered
D-type flip-flop (FD) or a level-sensitive latch (LD).
The storage-element-pair on either the Output path or the
Three-State path can be used together with a special multi-
plexer to produce Double-Data-Rate (DDR) transmission.
This is accomplished by taking data synchronized to the
clock signal’s rising edge and converting them to bits syn-
chronized on both the rising and the falling edge. The com-
bination of two registers and a multiplexer is referred to as a
Double-Data-Rate D-type flip-flop (FDDR).
See
Double-Data-Rate Transmission
, page 3
for more
information.
The signal paths associated with the storage element are
described in
Table 1
.
040
Spartan-3 1.2V FPGA Family:
Functional Description
DS099-2 (v1.2) July 11, 2003
0
0
Advance Product Specification
R
Table 1:
Storage Element Signal Description
Storage
Element
Signal
Description
Function
D
Data input
Data at this input is stored on the active edge of CK enabled by CE. For latch operation when the
input is enabled, data passes directly to the output Q.
Q
Data output
The data on this output reflects the state of the storage element. For operation as a latch in
transparent mode, Q will mirror the data at D.
CK
Clock input
A signal’s active edge on this input with CE asserted, loads data into the storage element.
CE
Clock Enable input
When asserted, this input enables CK. If not connected, CE defaults to the asserted state.
SR
Set/Reset
Forces storage element into the state specified by the SRHIGH/SRLOW attributes. The
SYNC/ASYNC attribute setting determines if the SR input is synchronized to the clock or not.
REV
Reverse
Used together with SR. Forces storage element into the state opposite from what SR does.
相關PDF資料
PDF描述
XC3S1000-4FG900C Spartan-3 FPGA Family : Complete Data Sheet
XC3S1000-4FG900I Spartan-3 FPGA Family : Complete Data Sheet
XC3S1000-4FT256C Spartan-3 FPGA Family : Complete Data Sheet
XC3S1000-4FT256I Spartan-3 FPGA Family : Complete Data Sheet
XC3S1000-4TQ144C Spartan-3 FPGA Family: Complete Data Sheet
相關代理商/技術參數(shù)
參數(shù)描述
XC3S1000-4FG900C 制造商:XILINX 制造商全稱:XILINX 功能描述:Spartan-3 FPGA Family : Complete Data Sheet
XC3S1000-4FG900I 制造商:XILINX 制造商全稱:XILINX 功能描述:Spartan-3 FPGA
XC3S1000-4FGG320C 功能描述:SPARTAN-3A FPGA 1M STD 320-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3 標準包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應商設備封裝:676-FBGA(27x27)
XC3S1000-4FGG320I 功能描述:IC SPARTAN-3A FPGA 1M 320-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3 標準包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應商設備封裝:676-FBGA(27x27)
XC3S1000-4FGG456C 功能描述:IC SPARTAN-3 FPGA 1M 456-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3 標準包裝:60 系列:XP LAB/CLB數(shù):- 邏輯元件/單元數(shù):10000 RAM 位總計:221184 輸入/輸出數(shù):244 門數(shù):- 電源電壓:1.71 V ~ 3.465 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:388-BBGA 供應商設備封裝:388-FPBGA(23x23) 其它名稱:220-1241