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參數資料
| 型號： | XC17S40XLPD8I |
| 廠商： | Xilinx Inc |
| 文件頁數： | 3/11頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC PROM PROG I-TEMP 3.3V 8-DIP |
| 產品變化通告： | Product Discontinuation 28/Jul/2010 |
| 標準包裝： | 50 |
| 可編程類型： | OTP |
| 存儲容量： | 400kb |
| 電源電壓： | 3 V ~ 3.6 V |
| 工作溫度： | -40°C ~ 85°C |
| 封裝/外殼： | 8-DIP（0.300"，7.62mm） |
| 供應商設備封裝： | 8-PDIP |
| 包裝： | 管件 |
Spartan/XL Family One-Time Programmable Configuration PROMs (XC17S00/XL)
DS030 (v1.12) June 20, 2008
Product Specification
11
R
Notice of Disclaimer
THE XILINX HARDWARE FPGA AND CPLD DEVICES REFERRED TO HEREIN (“PRODUCTS”) ARE SUBJECT TO THE TERMS AND
CONDITIONS OF THE XILINX LIMITED WARRANTY WHICH CAN BE VIEWED AT http://www.xilinx.com/warranty.htm. THIS LIMITED
WARRANTY DOES NOT EXTEND TO ANY USE OF PRODUCTS IN AN APPLICATION OR ENVIRONMENT THAT IS NOT WITHIN THE
SPECIFICATIONS STATED IN THE XILINX DATA SHEET. ALL SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE.
PRODUCTS ARE NOT DESIGNED OR INTENDED TO BE FAIL-SAFE OR FOR USE IN ANY APPLICATION REQUIRING FAIL-SAFE
PERFORMANCE, SUCH AS LIFE-SUPPORT OR SAFETY DEVICES OR SYSTEMS, OR ANY OTHER APPLICATION THAT INVOKES
THE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). USE OF PRODUCTS IN CRITICAL APPLICATIONS IS AT THE SOLE RISK OF CUSTOMER, SUBJECT TO
APPLICABLE LAWS AND REGULATIONS.
07/09/07
1.11
Updated document format.
Left diagram under "Pinout Diagrams," page 2 updated to reflect new Lead-free packaging.
Deleted parameter T
SOL, Maximum Soldering Temperature, under "Absolute Maximum Ratings
Added note to "DC Characteristics Over Operating Condition," page 6 and corrected XC17S40 I
CCA
value.
Added Lead-free (RoHS-compliant) packages PDG8 and VOG8 to "Ordering Information," page 9.
Added new part numbers to and deleted XC17S200XL from "Spartan 3.3V Valid Ordering Combinations
Added new Lead-free package types G and H to "Marking Information," page 10.
06/20/08
1.12
Updated document template.
Updated copyright statement.
Added junction temperature to "Absolute Maximum Ratings(1)," page 6.
Added support for XC17S30SOG8I.
Added new Lead-free package type O to "Marking Information," page 10.
Product Obsolete or Under Obsolescence
相關PDF資料 |
PDF描述 |
|---|---|
| AMM18DRSN | CONN EDGECARD 36POS DIP .156 SLD |
| XC17S40XLPD8C | IC PROM PROG C-TEMP 3.3V 8-DIP |
| TPSD475K050R0500 | CAP TANT 4.7UF 50V 10% 2917 |
| T97R686K025CBB | CAP TANT 68UF 25V 10% 3024 |
| XC17S40SO20I | IC PROM PROG I-TEMP 5V 20-SOIC |
相關代理商/技術參數 |
參數描述 |
|---|---|
| XC17S40XLPDG8C | 功能描述:IC PROM PROG C-TEMP 3.3V 8-DIP RoHS:是 類別:集成電路 (IC) >> 存儲器 - 用于 FPGA 的配置 Proms 系列:- 產品變化通告:Product Discontinuation 28/Jul/2010 標準包裝:98 系列:- 可編程類型:OTP 存儲容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應商設備封裝:8-TSOP 包裝:管件 |
| XC17S40XLSO20C | 功能描述:IC PROM PROG C-TEMP 3.3V 20-SOIC RoHS:否 類別:集成電路 (IC) >> 存儲器 - 用于 FPGA 的配置 Proms 系列:- 產品變化通告:Product Discontinuation 28/Jul/2010 標準包裝:98 系列:- 可編程類型:OTP 存儲容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應商設備封裝:8-TSOP 包裝:管件 |
| XC17S40XLSO20I | 功能描述:IC PROM PROG I-TEMP 3.3V 20-SOIC RoHS:否 類別:集成電路 (IC) >> 存儲器 - 用于 FPGA 的配置 Proms 系列:- 產品變化通告:Product Discontinuation 28/Jul/2010 標準包裝:98 系列:- 可編程類型:OTP 存儲容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應商設備封裝:8-TSOP 包裝:管件 |
| XC17S40XLSO20I0166 | 制造商:Xilinx 功能描述: |
| XC17S40XLVO8C | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Configuration EPROM |
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