參數(shù)資料
型號(hào): XC17S40XLPD8I
廠商: Xilinx Inc
文件頁數(shù): 2/11頁
文件大?。?/td> 0K
描述: IC PROM PROG I-TEMP 3.3V 8-DIP
產(chǎn)品變化通告: Product Discontinuation 28/Jul/2010
標(biāo)準(zhǔn)包裝: 50
可編程類型: OTP
存儲(chǔ)容量: 400kb
電源電壓: 3 V ~ 3.6 V
工作溫度: -40°C ~ 85°C
封裝/外殼: 8-DIP(0.300",7.62mm)
供應(yīng)商設(shè)備封裝: 8-PDIP
包裝: 管件
Spartan/XL Family One-Time Programmable Configuration PROMs (XC17S00/XL)
DS030 (v1.12) June 20, 2008
Product Specification
10
R
Marking Information
Due to the small size of the PROM package, the complete ordering part number cannot be marked on the package. The XC
prefix is deleted and the package code is simplified. Device marking is as follows.
Note: When marking the device number on the XL parts, an L is used in place of an XL.
Revision History
The following table shows the revision history for this document.
Date
Revision
07/14/98
1.1
Cosmetic edits for pages 1, 2, and 4.
09/08/98
1.2
Clarified the SPARTAN FPGA and PROM interface by removing references to CEO pin. Removed the ESD
notation in Absolute Maximum table since it is now included in Xilinx’s Reliability Monitor Report.
01/20/00
1.3
Added additional Spartan-XL parts, changed SPROM to PROM.
02/18/00
1.4
Changed device ordering numbers, added 4.7K resistor to OE/RESET in Figure 1.
04/04/00
1.5
Added XC17S200XL PROM for Spartan XC2S200.
08/06/00
1.6
Updated format.
04/07/01
1.7
Added to features: “Guaranteed 20 year life data retention.”
10/10/01
1.8
Added a note to Table 1. Changed VPP to VCC on Figure 1.
11/04/02
1.9
Updated Table 1, page 2. Updated the template. Added "Pinout Diagrams," page 2.
11/18/02
1.10
Modified document title.
17S20L
V
C
Operating Range/Processing
C = Commercial (TA = 0°C to +70°C)
I = Industrial (TA = –40°C to +85°C)
Package Mark
O = 8-pin Plastic Small-Outline Package, Lead-Free
P = 8-pin Plastic DIP
H = 8-pin Plastic DIP, Lead-Free
V = 8-pin Plastic Small-Outline Thin Package
G = 8-pin Plastic Small-Outline Thin Package, Lead-Free
S = 20-pin Plastic Small-Outline Package
Device Number
17S05
17S05L
17S10
17S10L
17S20
17S20L
17S30
17S30L
17S40
17S40L
17S50L
17S100L
17S150L
Product Obsolete or Under Obsolescence
相關(guān)PDF資料
PDF描述
AMM18DRSN CONN EDGECARD 36POS DIP .156 SLD
XC17S40XLPD8C IC PROM PROG C-TEMP 3.3V 8-DIP
TPSD475K050R0500 CAP TANT 4.7UF 50V 10% 2917
T97R686K025CBB CAP TANT 68UF 25V 10% 3024
XC17S40SO20I IC PROM PROG I-TEMP 5V 20-SOIC
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XC17S40XLPDG8C 功能描述:IC PROM PROG C-TEMP 3.3V 8-DIP RoHS:是 類別:集成電路 (IC) >> 存儲(chǔ)器 - 用于 FPGA 的配置 Proms 系列:- 產(chǎn)品變化通告:Product Discontinuation 28/Jul/2010 標(biāo)準(zhǔn)包裝:98 系列:- 可編程類型:OTP 存儲(chǔ)容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC(0.154",3.90mm 寬) 供應(yīng)商設(shè)備封裝:8-TSOP 包裝:管件
XC17S40XLSO20C 功能描述:IC PROM PROG C-TEMP 3.3V 20-SOIC RoHS:否 類別:集成電路 (IC) >> 存儲(chǔ)器 - 用于 FPGA 的配置 Proms 系列:- 產(chǎn)品變化通告:Product Discontinuation 28/Jul/2010 標(biāo)準(zhǔn)包裝:98 系列:- 可編程類型:OTP 存儲(chǔ)容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC(0.154",3.90mm 寬) 供應(yīng)商設(shè)備封裝:8-TSOP 包裝:管件
XC17S40XLSO20I 功能描述:IC PROM PROG I-TEMP 3.3V 20-SOIC RoHS:否 類別:集成電路 (IC) >> 存儲(chǔ)器 - 用于 FPGA 的配置 Proms 系列:- 產(chǎn)品變化通告:Product Discontinuation 28/Jul/2010 標(biāo)準(zhǔn)包裝:98 系列:- 可編程類型:OTP 存儲(chǔ)容量:300kb 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC(0.154",3.90mm 寬) 供應(yīng)商設(shè)備封裝:8-TSOP 包裝:管件
XC17S40XLSO20I0166 制造商:Xilinx 功能描述:
XC17S40XLVO8C 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Configuration EPROM