ICCAUXQ Quies" />
參數(shù)資料
型號(hào): XA3S500E-4PQG208Q
廠商: Xilinx Inc
文件頁(yè)數(shù): 2/37頁(yè)
文件大?。?/td> 0K
描述: IC FPGA SPARTAN-3E 500K 208-PQFP
標(biāo)準(zhǔn)包裝: 24
系列: Spartan®-3E XA
LAB/CLB數(shù): 1164
邏輯元件/單元數(shù): 10476
RAM 位總計(jì): 368640
輸入/輸出數(shù): 158
門(mén)數(shù): 500000
電源電壓: 1.14 V ~ 1.26 V
安裝類(lèi)型: 表面貼裝
工作溫度: -40°C ~ 125°C
封裝/外殼: 208-BFQFP
供應(yīng)商設(shè)備封裝: 208-PQFP(28x28)
DS635 (v2.0) September 9, 2009
Product Specification
10
R
ICCAUXQ
Quiescent VCCAUX
supply current
XA3S100E
13
22
mA
XA3S250E
26
43
mA
XA3S500E
34
63
mA
XA3S1200E
59
100
mA
XA3S1600E
86
150
mA
Notes:
1.
The numbers in this table are based on the conditions set forth in Table 6.
2.
Quiescent supply current is measured with all I/O drivers in a high-impedance state and with all pull-up/pull-down resistors at the I/O pads
disabled. Typical values are characterized using typical devices at room temperature (TJ of 25°C at VCCINT = 1.2 V, VCCO = 3.3V, and
VCCAUX = 2.5V). The maximum limits are tested for each device at the respective maximum specified junction temperature and at maximum
voltage limits with VCCINT = 1.26V, VCCO = 3.465V, and VCCAUX = 2.625V. The FPGA is programmed with a “blank” configuration data file
(i.e., a design with no functional elements instantiated). For conditions other than those described above, (e.g., a design including functional
elements), measured quiescent current levels may be different than the values in the table. For more accurate estimates for a specific
design, use the Xilinx XPower tools.
3.
There are two recommended ways to estimate the total power consumption (quiescent plus dynamic) for a specific design: a) The
Spartan-3E XPower Estimator provides quick, approximate, typical estimates, and does not require a netlist of the design. b) XPower
Analyzer uses a netlist as input to provide maximum estimates as well as more accurate typical estimates.
4.
The maximum numbers in this table indicate the minimum current each power rail requires in order for the FPGA to power-on successfully.
Table 8: Quiescent Supply Current Characteristics (Continued)
Symbol
Description
Device
I-Grade Maximum
Q-Grade
Maximum
Units
相關(guān)PDF資料
PDF描述
RCB100DHBS CONN EDGECARD 200PS R/A .050 DIP
XC2S200-5FGG256I IC SPARTAN-II FPGA 200K 256-FBGA
RCB95DHAR CONN EDGECARD 190PS R/A .050 DIP
XC2S200-6FG256C IC FPGA 2.5V C-TEMP 256-FBGA
ASM40DRMI-S288 CONN EDGECARD 80POS .156 EXTEND
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XA3S50-4PQG208I 功能描述:IC FPGA SPARTAN-3 50K 208-PQFP RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門(mén)陣列) 系列:Spartan®-3 XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門(mén)數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類(lèi)型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XA3S50-4PQG208Q 功能描述:IC FPGA SPARTAN-3 50K 208-PQFP RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門(mén)陣列) 系列:Spartan®-3 XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門(mén)數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類(lèi)型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XA3S50-4VQG100I 功能描述:IC FPGA SPARTAN-3 50K 100-VQFP RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門(mén)陣列) 系列:Spartan®-3 XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門(mén)數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類(lèi)型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XA3S50-4VQG100Q 功能描述:IC FPGA SPARTAN-3 50K 100-VQFP RoHS:是 類(lèi)別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門(mén)陣列) 系列:Spartan®-3 XA 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門(mén)數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類(lèi)型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XA3S700A 制造商:XILINX 制造商全稱(chēng):XILINX 功能描述:XA Spartan-3A Automotive FPGA Family Data Sheet