參數(shù)資料
型號: WEDPNF8M722V-1010BI
廠商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分類: 存儲器
英文描述: SPECIALTY MEMORY CIRCUIT, PBGA275
封裝: 32 X 25 MM, PLASTIC, BGA-275
文件頁數(shù): 32/43頁
文件大?。?/td> 1280K
代理商: WEDPNF8M722V-1010BI
38
White Electronic Designs Corporation Phoenix AZ (602) 437-1520
White Electronic Designs
WEDPNF8M722V-XBX
HARDWARE RESET (RST)
Parameter
Description
Test Setup
All Speed Options
Unit
tReady
RST Pin Low (During Embedded
Algorithms) to Read or Write (See Note)
Max
20
s
tReady
RST Pin Low ( NOT During Embedded
Algorithms) to Read or Write (See Note)
Max
500
ns
tRP
RST Pulse Width
Min
500
ns
tRH
RST High Time Before Read (See Note)
Min
50
ns
tRPD
RST Low to Standby Mode
Min
20
s
tRB
RY/BY1 Recovery Time
Min
0
ns
Note:
Not 100% tested.
FIG. 19
相關(guān)PDF資料
PDF描述
WME128K8-150CC 128K X 8 EEPROM 5V, 150 ns, CDIP32
WME128K8-150DEIA 128K X 8 EEPROM 5V, 150 ns, CDSO32
WMF128K8-120FFQ5A 128K X 8 FLASH 5V PROM, 120 ns, CDFP32
WMF128K8-70CQ5 128K X 8 FLASH 5V PROM, 70 ns, CDIP32
WMF128K8-70FFI5A 128K X 8 FLASH 5V PROM, 70 ns, CDFP32
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
WEDPNF8M722V-1010BM 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package
WEDPNF8M722V-1012BC 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package
WEDPNF8M722V-1012BI 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package
WEDPNF8M722V-1012BM 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package
WEDPNF8M722V-1015BC 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package