參數(shù)資料
型號(hào)： WEDPF2M64B-70BM3
廠商： WHITE ELECTRONIC DESIGNS CORP
元件分類： PROM
英文描述： 2M X 64 FLASH 3.3V PROM MODULE, 70 ns, PBGA119
封裝： STACKED TSOP, BGA-119
文件頁(yè)數(shù)： 12/13頁(yè)
文件大?。?/td> 317K
代理商： WEDPF2M64B-70BM3
8
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
WEDPF2M64-XBX3
NOTES:
1. PA is the address of the memory location to be programmed.
2. PD is the data to be programmed at byte address.
3. D7 is the output of the complement of the data written to each chip.
4. DOUT is the output of the data written to the device.
5. Figure indicates last two bus cycles of four bus cycle sequence.
FIG6:WRITE/ERASE/PROGRAM
OPERATION, WE CONTROLLED
RY/BY
tRB
tB
U
S
Y
Addresses
CS
OE
WE
Data
AAAH
PA
tWC
tCS
PD
D
7
D
OUT
tAH
tWPH
tDH
tDS
Data
Polling
tAS
tRC
tWP
A0H
tOE
tDF
tOH
tGHWL
tWHWH1
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