參數(shù)資料
型號(hào): W3H32M72E-400SB2M
廠商: WHITE ELECTRONIC DESIGNS CORP
元件分類: DRAM
英文描述: 32M X 72 DDR DRAM, 0.6 ns, PBGA208
封裝: 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208
文件頁(yè)數(shù): 20/30頁(yè)
文件大?。?/td> 0K
代理商: W3H32M72E-400SB2M
W3H32M72E-XSB2X
27
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
September 2009
Rev. 1
White Electronic Designs Corp. reserves the right to change products or specications without notice.
AC TIMING PARAMETERS
(continued)
-55°C ≤ TA < +125°C; VCCQ = + 1.8V ± 0.1V, VCC = +1.8V ± 0.1V
Parameter
Symbol
667Mbs CL5
533Mbs CL4
400Mbs CL3
Unit
Min
Max
Min
Max
Min
Max
ODT
ODT tum-on delay
tAOND
222222
tCK
ODT turn-on
tAON
tAC(MIN)
tAC(MAX) +
1000
tAC(MIN)
tAC(MAX) +
1000
tAC(MIN)
tAC(MAX) +
1000
ps
ODT turn-off delay
tAOFD
2.5
tCK
ODT tum-off
tAOF
tAC(MIN)
tAC(MAX) +
600
tAC(MIN)
tAC(MAX) +
600
tAC(MIN)
tAC(MAX) +
600
ps
ODT tum-on (power-down mode)
tAONPD
tAC(MIN) +
2000
2 x tCK +
tAC(MAX) +
1000
tAC(MIN) +
2000
2 x tCK +
tAC(MAX) +
1000
tAC(MIN) +
2000
2 x tCK +
tAC(MAX) +
1000
ps
ODT turn-off (power-down mode)
tAOFPD
tAC(MIN) +
2000
2 x tCK +
tAC(MAX) +
1000
tAC(MIN) +
2000
2 x tCK +
tAC(MAX) +
1000
tAC(MIN) +
2000
2 x tCK +
tAC(MAX) +
1000
ps
ODT to power-down entry latency
tANPD
333
tCK
ODT power-down exit latency
tAXPD
888
tCK
Power-Down
Exit active power-down to READ command,
MR[bit12=0]
tXARD
222
tCK
Exit active power-down to READ command,
MR[bit12=1]
tXARDS
7-AL
6-AL
tCK
Exit precharge power-down to any non-READ
command
tXP
222
tCK
CKE minimum high/low time
tCKE
333
tCK
相關(guān)PDF資料
PDF描述
W3HG2128M72AER403AD6SG 256M X 72 DDR DRAM MODULE, 0.6 ns, DMA240
W3HG2128M72AER534AD6MG 256M X 72 DDR DRAM MODULE, 0.5 ns, DMA240
W3HG2128M72AER665AD6SG 256M X 72 DDR DRAM MODULE, 0.45 ns, DMA240
W3HG2128M72AER534AD6SG 256M X 72 DDR DRAM MODULE, 0.5 ns, DMA240
W51-C112B1-20 ROCKER SWITCH, SPDT, LATCHED, 20A, 50VDC, THROUGH HOLE-RIGHT ANGLE
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
W3H32M72E-400SBC 制造商:Microsemi Corporation 功能描述:32M X 72 DDR2, 1.8V, 400MHZ, 208PBGA COMMERICAL TEMP. - Bulk
W3H32M72E-400SBI 制造商:Microsemi Corporation 功能描述:32M X 72 DDR2, 1.8V, 400MHZ, 208PBGA INDUSTRIAL TEMP. - Bulk
W3H32M72E-400SBM 制造商:Microsemi Corporation 功能描述:32M X 72 DDR2, 1.8V, 400MHZ, 208PBGA MIL-TEMP. - Bulk
W3H32M72E-533ES 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H32M72E-533ESC 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package