- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄245658 > W25Q16CVTCAG (WINBOND ELECTRONICS CORP) 16M X 1 SPI BUS SERIAL EEPROM, PBGA24 PDF資料下載
參數(shù)資料
| 型號(hào)： | W25Q16CVTCAG |
| 廠商： | WINBOND ELECTRONICS CORP |
| 元件分類： | PROM |
| 英文描述： | 16M X 1 SPI BUS SERIAL EEPROM, PBGA24 |
| 封裝： | 8 X 6 MM, GREEN, TFBGA-24 |
| 文件頁數(shù)： | 77/79頁 |
| 文件大小： | 1131K |
| 代理商： | W25Q16CVTCAG |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁當(dāng)前第77頁第78頁第79頁
W25Q16CV
Publication Release Date: April 01, 2011
- 79 -
Revision C
11. REVISION HISTORY
VERSION
DATE
PAGE
DESCRIPTION
A
01/04/10
New Create Preliminary
B
07/15/10
17
61, 64
5, 62 & 66
5, 10, 21, 56-58
5, 75 & 76
Updated memory protection table
Updated parameter VIL/VIH, Icc, tSE
Updated fR & FR Frequenices
Added SFDP feature
Added automotive temperature
C
04/01/11
9, 76-78, 23-69,
47
57-59
Added TFBGA package
Updated diagrams
Added /WP timing diagram
Updated Suspend description
Updated SFDP to JEDEC 1.0
Removed Preliminary designator
Trademarks
Winbond and SpiFlash are trademarks of Winbond Electronics Corporation.
All other marks are the property of their respective owner.
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components in systems
or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship
instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for
other applications intended to support or sustain life. Further more, Winbond products are not intended for
applications wherein failure of Winbond products could result or lead to a situation wherein personal injury,
death or severe property or environmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify Winbond for any damages resulting from such improper use or sales.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| WF2M32S-100HM | 8M X 8 FLASH 5V PROM MODULE, 100 ns, CHIP66 |
| WF2M32S-100HC | 8M X 8 FLASH 5V PROM MODULE, 100 ns, CHIP66 |
| WF2M32S-120GTC | 8M X 8 FLASH 5V PROM MODULE, 120 ns, CQFP68 |
| WF2M32S-80GTM | 8M X 8 FLASH 5V PROM MODULE, 80 ns, CQFP68 |
| WPS256K16VC-20LJM | 256K X 16 STANDARD SRAM, 20 ns, PDSO44 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| W25Q16CVTCAP | 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q16CVTCIG | 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q16CVTCIP | 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q16CVZPAG | 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q16CVZPAP | 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。