參數(shù)資料
型號(hào): W25Q16CVTCAG
廠商: WINBOND ELECTRONICS CORP
元件分類: PROM
英文描述: 16M X 1 SPI BUS SERIAL EEPROM, PBGA24
封裝: 8 X 6 MM, GREEN, TFBGA-24
文件頁數(shù): 75/79頁
文件大小: 1131K
代理商: W25Q16CVTCAG
W25Q16CV
Publication Release Date: April 01, 2011
- 77 -
Revision C
10. ORDERING INFORMATION
W(1) 25Q 16C V xx(2)
I = Industrial (-40°C to +85°C)
A = Automotive (-40°C to +105°C)
SN = 8-pin SOIC 150-mil
ZP = 8-pad WSON 6x5-mm
SF = 16-pin SOIC 300-mil
SS = 8-pin SOIC 208-mil
DA = 8-pin PDIP 300-mil
TC = 24-ball TFBGA 8x6-mm
(3,4)
G =
Green Package (Lead-free, RoHS Compliant, Halogen-free (TBBA), Antimony-Oxide-free Sb2O3)
P
=
Green Package with Status Register Power-Down & OTP enabled
V = 2.7V to 3.6V
16C = 16M-bit
25Q = SpiFlash Serial Flash Memory with 4KB sectors, Dual/Quad I/O
W = Winbond
Notes:
1. The “W” prefix is not included on the part marking.
2. Only the 2
nd letter is used for the part marking; WSON package type ZP is not used for the part marking.
3. Standard bulk shipments are in Tube (shape E). Please specify alternate packing method, such as Tape and
Reel (shape T) or Tray (shape S), when placing orders.
4. For shipments with OTP feature enabled, please specify when placing orders.
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