- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄383984 > UPD78218AGC (NEC Corp.) 8-bit Microcontroller with 2/4/8K Bytes In-System Programmable Flash PDF資料下載
參數(shù)資料
| 型號： | UPD78218AGC |
| 廠商： | NEC Corp. |
| 元件分類： | 8位微控制器 |
| 英文描述： | 8-bit Microcontroller with 2/4/8K Bytes In-System Programmable Flash |
| 中文描述： | 8位微控制器與2/4/8K字節(jié)在系統(tǒng)可編程閃存 |
| 文件頁數(shù)： | 59/66頁 |
| 文件大?。?/td> | 510K |
| 代理商： | UPD78218AGC |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁當前第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁
59
μ
PD78217A, 78218A
8.
RECOMMENDED SOLDERING CONDITIONS
The
μ
PD78217A/78218A should be soldered and mounted under the conditions recommended in the table below.
For detail of recommended soldering conditions, refer to the information document
“Semiconductor Device Mounting
Technology Manual” (IEI-1207)
.
For soldering methods and conditions other than those recommended below, contact an NEC sales represen-
tative.
Table 8-1 Surface Mounting Type Soldering Conditions
#
Soldering Method
Soldering Conditions
Infrared ray reflow
IR35-00-2
Package peak temperature: 235
°
C, Reflow time: 30 seconds or less (at 210
°
C or
higher), Maximum number of reflow processes: 2 times
<Cautions>
(1) After the first reflow process, cool the package down to room temperature , then
start the second reflow process.
(2) After the first reflow process, do not use water to remove residual flux.
Package peak temperature: 215
°
C, Reflow time: 40 seconds or less (at 200
°
C or
higher), Maximum number of reflow processes: 2 times
<Cautions>
(1) After the first reflow process, cool the package down to room temperature , then
start the second reflow process.
(2) After the first reflow process, do not use water to remove residual flux.
Pin temperature: 300
°
C or below, Heat time: 3 seconds or less (per each side of
the device)
VPS
Partial heating
VP15-00-2
–––
Caution
Apply only one kind of soldering method to a device, except for partial heating method.
μ
PD78217AGC-AB8/78218AGC-
×××
-AB8 : 64-pin plastic QFP (14 x 14 mm)
Symbol
Table 8-2 Insertion Type Soldering Conditions
Solder temperature: 260
°
C or below, Flow time: 10 seconds or less
Pin temperature: 300
°
C or below, Heat time: 3 seconds or less (per pin)
Partial heating
Caution
The wave soldering process must be applied only to pins, and make sure that the package body does
not get jet soldered.
Soldering Method
Soldering Conditions
Wave soldering
(pin only)
μ
PD78217ACW/78218ACW-
×××
: 64-pin plastic shrink DIP (750 mil)
相關PDF資料 |
PDF描述 |
|---|---|
| UPD78330 | 16/8 Bit Single-Chip Microcomputer |
| UPD78330GJ-5BG | 16/8 Bit Single-Chip Microcomputer |
| UPD78330LQ | 16/8 Bit Single-Chip Microcomputer |
| UPD78334 | 16/8 Bit Single-Chip Microcomputer |
| UPD78334GJ | 16/8 Bit Single-Chip Microcomputer |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| UPD78365AGF3B9 | 制造商: 功能描述: 制造商:undefined 功能描述: |
| UPD784031GC-8BT-A | 制造商:Renesas Electronics Corporation 功能描述:MCU 8BIT/16BIT 78K4 CISC ROMLESS 3.3V/5V 80PQFP - Trays 制造商:Renesas Electronics 功能描述:16 制造商:Renesas Electronics 功能描述:16 Cut Tape |
| UPD784031GK-9EU-A | 制造商:Renesas Electronics Corporation 功能描述:16BIT K4 ROMLESS - Bulk |
| UPD784031YGC-8BT | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD784031YGC-8BT-A | 制造商:Renesas Electronics Corporation 功能描述: |
發(fā)布緊急采購，3分鐘左右您將得到回復。