參數(shù)資料
型號: UPD780021AYGC-XXX-8BS
元件分類: 微控制器/微處理器
英文描述: 8-BIT, MROM, 8.38 MHz, MICROCONTROLLER, PQFP64
封裝: 14 X 14 MM, PLASTIC, LQFP-64
文件頁數(shù): 83/96頁
文件大小: 723K
代理商: UPD780021AYGC-XXX-8BS
84
PD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY
Data Sheet U14042EJ4V0DS
Table 14-1. Surface Mounting Type Soldering Conditions (2/3)
(3)
PD780021AGK-×××
×××
×××-9ET: 64-pin plastic TQFP (12 x 12)
PD780022AGK-×××
×××
×××-9ET: 64-pin plastic TQFP (12 x 12)
PD780023AGK-×××
×××
×××-9ET: 64-pin plastic TQFP (12 x 12)
PD780024AGK-×××
×××
×××-9ET: 64-pin plastic TQFP (12 x 12)
PD780021AYGK-×××
×××
×××-9ET: 64-pin plastic TQFP (12 x 12)
PD780022AYGK-×××
×××
×××-9ET: 64-pin plastic TQFP (12 x 12)
PD780023AYGK-×××
×××
×××-9ET: 64-pin plastic TQFP (12 x 12)
PD780024AYGK-×××
×××
×××-9ET: 64-pin plastic TQFP (12 x 12)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°C, Time: 30 seconds max.
IR35-107-2
(at 210
°C or higher), Count: Two times or less, Exposure limit:
7 daysNote (after that, prebake at 125
°C for 10 hours)
VPS
Package peak temperature: 215
°C, Time: 40 seconds max.
VP15-107-2
(at 200
°C or higher), Count: Two times or less, Exposure limit:
7 daysNote (after that, prebake at 125
°C for 10 hours)
Wave soldering
Solder bath temperature: 260
°C max., Time: 10 seconds max.,
WS60-107-1
Count: Once, Preheating temperature: 120
°C Max. (package surface
temperature), Exposure limit: 7 daysNote (after that, prebake at 125
°C
for 10 hours)
Partial heating
Pin temperature: 300
°C max., Time: 3 seconds max. (per pin row)
Note
After opening the dry pack, store it at 25
°C or less and 65%RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
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