參數(shù)資料
型號(hào): TVP5160PNP
廠商: TEXAS INSTRUMENTS INC
元件分類: 顏色信號(hào)轉(zhuǎn)換
英文描述: COLOR SIGNAL DECODER, PQFP128
封裝: GREEN, PLASTIC, HTQFP-128
文件頁(yè)數(shù): 6/111頁(yè)
文件大?。?/td> 1400K
代理商: TVP5160PNP
SLES135E
– FEBRUARY 2005 – REVISED APRIL 2011
6.10 Memories Tested
Table 6-1. Memories Tested
MANUFACTURER
PART NUMBER
SIZE
MBYTES
SPEED
PINS
3DYC
3DNR
3DYC+3DNR
Samsung
K4S641632H-TC75
4 Meg x 16
8 MB
133 MHz
54
Y
Samsung
K4S641632H-TC70
4 Meg x 16
8 MB
143 MHz
54
Y
Samsung
K4S161622E-TC60
1 Meg x 16
2 MB
166 MHz
50
Y
N
Samsung
K4S161622H-TC60
1 Meg x 16
2 MB
166 MHz
54
Y
N
Etron
EM638165TS-6
4 Meg x 16
8 MB
166 MHz
54
Y
Etron
EM638165TS-7
4 Meg x 16
8 MB
143 MHz
54
Y
Micron
MT48LC8M16A2TG-75
8 Meg x 16
16 MB
133 MHz
54
Y
Micron
MT48LC4M16A2TG-75
4 Meg x 16
8 MB
133 MHz
54
Y
ISSI
IS42S16100C1-7TL
1 Meg x 16
2 MB
143 MHz
50
Y
N
ISSI
IS42S16400B-7TL
4 Meg x 16
8 MB
133 MHz
54
Y
6.11 Thermal Specification
(1)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Thermal pad soldered to 4-layer
θJA
Junction-to-ambient thermal resistance, still air
17.17
°C/W
High-K PCB
Thermal pad soldered to 4-layer
θJC
Junction-to-case thermal resistance, still air
0.12
°C/W
High-K PCB
TJ(MAX)
Maximum junction temperature for reliable operation
105
°C
(1)
The exposed thermal pad must be soldered to a JEDEC High-K PCB with adequate ground plane. When split ground planes are used,
attach the thermal pad to the digital ground plane.
Copyright
2005–2011, Texas Instruments Incorporated
Electrical Specifications
103
focus.ti.com: TVP5160
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