參數(shù)資料
型號: TPS796xxyyyz
廠商: Texas Instruments, Inc.
英文描述: ULTRALOW-NOISE, HIGH PSRR, FAST, RF, 1A LOW-DROPOUT LINEAR REGULATORS
中文描述: 超低噪聲,高PSRR,快速,射頻低壓差線性穩(wěn)壓器1A條
文件頁數(shù): 12/33頁
文件大?。?/td> 899K
代理商: TPS796XXYYYZ
www.ti.com
0
0.1
100
120
140
160
180
PCB Copper Area in
2
θ
J
R
C
°
No Air Flow
80
60
40
20
1
10
1
0.1
2
3
4
5
1
10
100
Copper Heatsink Area cm
2
T
A
= 55
°
C
No Air Flow
150 LFM
250 LFM
P
D
SOT223 Power Dissipation
The SOT223 package provides an effective means
of managing power dissipation in surface mount
applications. The SOT223 package dimensions are
provided in the
Mechanical Data
section at the end
of the data sheet. The addition of a copper plane
directly underneath the SOT223 package enhances
the thermal performance of the package.
P
D
max
(3.3
2.5) V x 1 A
800 mW
(10)
R
θ
JAmax
(125
55)
°
C 800 mW
87.5
°
C W
0
1
2
3
6
0
25
50
75
100
150
125
T
A
= 25
°
C
T
A
(
°
C)
4
5
4 in
2
PCB Area
0.5 in
2
PCB Area
P
D
TPS796xx
SLVS351I–SEPTEMBER 2002–REVISED MAY 2006
Figure 28. SOT223 Thermal Resistance vs PCB
Area
Figure 27. Maximum Power Dissipation vs
Copper Heatsink Area
From
Equation 6
, the maximum power dissipation for a
different ground plane area and a specific ambient
temperature can be computed (see
Figure 29
).
the
data
in
Figure
28
and
rearranging
To illustrate, the TPS72525 in a SOT223 package
was chosen. For this example, the average input
voltage is 3.3V, the output voltage is 2.5V, the
average
output
current
temperature 55°C, no air flow is present, and the
operating environment is the same as documented
below.
Neglecting
the
maximum
average
power
Equation 10
:
is
1A,
the
ambient
quiescent
current,
calculated
the
as
is
Substituting T
J
max for T
J
into
Equation 6
gives
Equation 11
:
(11)
Figure 29. SOT223 Power Dissipation
From
Figure 28
, R
θ
JA
vs PCB Copper Area, the
ground plane needs to be 0.55in
2
for the part to
dissipate 800mW. The operating environment used
to construct
Figure 28
consisted of a board with 1-oz.
copper planes. The package is soldered to a 1-oz.
copper pad on the top of the board. The pad is tied
through thermal vias to the 1-oz. ground plane.
12
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