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| 型號： | TPS796xxyyyz |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | ULTRALOW-NOISE, HIGH PSRR, FAST, RF, 1A LOW-DROPOUT LINEAR REGULATORS |
| 中文描述： | 超低噪聲，高PSRR，快速，射頻低壓差線性穩(wěn)壓器1A條 |
| 文件頁數(shù)： | 11/33頁 |
| 文件大小： | 899K |
| 代理商： | TPS796XXYYYZ |
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R
θ
JAmax
(125
55)
°
C 2.5 W
28
°
C W
(9)
TJ
TA
P
D
max x R
θ
JA
(6)
R
θ
JA
T
J
–T
A
P
D
max
(7)
15
20
25
30
35
40
0.1
1
10
100
Copper Heatsink Area cm
2
J
R
C
°
No Air Flow
150 LFM
250 LFM
DDPAK Power Dissipation
The DDPAK package provides an effective means of
managing
power
dissipation
applications. The DDPAK package dimensions are
provided in the
Mechanical Data
section at the end
of the data sheet. The addition of a copper plane
directly underneath the DDPAK package enhances
the thermal performance of the package.
1 oz. Copper
Power Plane
1 oz. Copper
Ground Plane
2 oz. Copper Solder Pad
with 25 Thermal Vias
Thermal Vias, 0.3 mm
Diameter, 1,5 mm Pitch
P
D
max
(5
2.5) V x 1 A
2.5 W
(8)
TPS796xx
SLVS351I–SEPTEMBER 2002–REVISED MAY 2006
Even if no external
black body radiator
type heatsink
is attached to the package, the board on which the
regulator is mounted provides some heatsinking
through the pin solder connections. Some packages,
like the DDPAK and SOT223 packages, use a
copper plane underneath the package or the circuit
board's ground plane for additional heatsinking to
improve their thermal performance. Computer-aided
thermal modeling can be used to compute very
accurate approximations of an integrated circuit's
thermal
performance
environments (e.g., different types of circuit boards,
different types and sizes of heatsinks, and different
air flows, etc.). Using these models, the three
thermal resistances can be combined into one
thermal resistance between junction and ambient
(R
). This R
is valid only for the specific
operating environment used in the computer model.
From
Figure 25
, DDPAK Thermal Resistance vs
Copper Heatsink Area, the ground plane needs to be
1cm
2
for the part to dissipate 2.5W. The operating
environment used in the computer model to construct
Figure 25
consisted of a standard JEDEC High-K
board (2S2P) with a 1-oz. internal copper plane and
ground plane. The package is soldered to a 2-oz.
copper pad. The pad is tied through thermal vias to
the 1-oz. ground plane.
Figure 26
shows the side
view of the operating environment used in the
computer model.
in
different
operating
Equation 5
simplifies into
Equation 6
:
Rearranging
Equation 6
gives
Equation 7
:
Using
Equation 6
and the computer model generated
curves shown in
Figure 25
and
Figure 28
, a designer
can quickly compute the required heatsink thermal
resistance/board
area
temperature,
power
dissipation,
environment.
for
a
given
and
ambient
operating
Figure 25. DDPAK Thermal Resistance vs Copper
Heatsink Area
in
surface
mount
To illustrate, the TPS72525 in a DDPAK package
was chosen. For this example, the average input
voltage is 5V, the output voltage is 2.5V, the average
output current is 1A, the ambient temperature 55
°
C,
the
air
flow
is
150
LFM,
environment is the same as documented below.
Neglecting the quiescent current, the maximum
average power is calculated as
Equation 8
:
and
the
operating
Figure 26. DDPAK Thermal Resistance
From
Equation 6
, the maximum power dissipation for a
different ground plane area and a specific ambient
temperature can be computed.
the
data
in
Figure
27
and
rearranging
Substituting T
J
max for T
J
into
Equation 6
gives
Equation 9
:
11
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| TPS79718DCKT | 功能描述:低壓差穩(wěn)壓器 - LDO 10-mA 1.8-V LDO RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-20 |
| TPS79718DCKTG4 | 功能描述:低壓差穩(wěn)壓器 - LDO 10-mA 1.8-V LDO RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-20 |
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