參數(shù)資料
型號： TPS65950ZXNR
廠商： TEXAS INSTRUMENTS INC
元件分類： 消費家電
英文描述： SPECIALTY CONSUMER CIRCUIT, PBGA209
封裝： 7 X 7 MM, 0.40 MM PITCH, PLASTIC, BGA-209
文件頁數(shù)： 156/167頁
文件大?。?/td> 2566K
代理商： TPS65950ZXNR
DIG.MIC.CLK0/1
DIG.MIC.0/1
thold
032-036
6.2.1.4 Silicon Microphone Characteristics
TPS65950
Integrated Power Management/Audio Codec
www.ti.com
SWCS032 – OCTOBER 2008
Table 6-19. Digital Microphone Bias Module Characteristics (2) (continued)
Parameter
Test Conditions
Min(1)
Typ(2)
Max(3)
Unit
DIG.MIC.0 (tHOLD) from DIG.MIC.CLK0 edge
4
ns
DIG.MIC.1 (tHOLD) from DIG.MIC.CLK1 edge
4
ns
Figure 6-23 is the timing diagram for the digital microphone bias module.
Figure 6-23. Digital Microphone Bias Module Timing Diagram
Based on silicon micro-electrical-mechanical system (MEMS) technology, the new microphone achieves
the same acoustic and electrical properties as conventional microphones, but is more rugged and exhibits
higher heat resistance. These properties offer designers of a wide range of products greater flexibility and
new opportunities to integrate microphones.
The silicon microphone is the integration of mechanical elements and electronics on a common silicon
substrate through microfabrication technology.
The complementary metal oxide semiconductor (CMOS) MEMS microphone is more like an analog IC
than a classic electric condenser microphone (ECM). It is powered as an IC with a direct connection to the
power supply. The on-chip isolation between the power input and the rest of the system adds power
supply rejection to the component, making the CMOS MEMS microphone inherently more immune to
power supply noise than an ECM and eliminating the need for additional filtering circuitry to keep the
power supply line clean.
Figure 6-24 is a schematic of the silicon microphone module.
Audio/Voice Module
89
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