參數(shù)資料
型號: TPS65185RSLT
廠商: TEXAS INSTRUMENTS INC
元件分類: 電源管理
英文描述: POWER SUPPLY SUPPORT CKT, PQCC48
封裝: 6 X 6 MM, 0.4 MM PITCH, 0.9 MM HEIGHT, PLASTIC, VQFN-48
文件頁數(shù): 45/49頁
文件大?。?/td> 2488K
代理商: TPS65185RSLT
PRODUCTPREVIEW
SLVSAQ8A
– FEBRUARY 2011 – REVISED MAY 2011
TERMINAL
I/O
DESCRIPTION
NAME
NO.
Thermistor input pin. Connect a 10k NTC thermistor and a 43k linearization resistor
TS
47
I
between this pin and AGND.
AGND2
48
Reference point to external thermistor and linearization resistor
Power Pad, internally connected to PBKG. Connect to VN with short, wide trace. Wide
PowerPad
N/A
copper trace will improve heat dissipation. PowerPad must not be connected to ground.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1) (2)
VALUE
UNIT
Input voltage range at VIN(2), VIN_P, VIN3P3
–0.3 to 7
V
Ground pins to system ground
–0.3 to 0.3
V
Voltage range at SDA, SCL, WAKEUP, PWRUP, VCOM_CTRL, VDDH_FB, VEE_FB,
–0.3 to 3.6
V
PWR_GOOD, nINT
Voltage on VB, VB_SW, VPOS_IN, VPOS_DIS, VDDH_IN
–0.3 to 20
V
VDDH_DIS
–0.3 to 30
V
Voltage on VN, VEE_IN, VCOM_PWR, VNEG_DIS, VNEG_IN
–20 to 0.3
V
Voltage from VIN_P to VN_SW
–0.3 to 30
V
Voltage on VCOM_DIS
–5 to 0.3
V
VEE_DIS
–30 to 0.3
V
Peak output current
Internally limited
mA
Continuous total power dissipation
2
W
θJA
Junction-to-ambient thermal resistance(3)
23
°C/W
TJ
Operating junction temperature
-10 to 125
°C
TA
Operating ambient temperature(4)
-10 to 85
°C
Tstg
Storage temperature
-65 to 150
°C
(HBM) Human body model
±2000
ESD rating
V
(CDM) Charged device model
±500
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
(2)
All voltage values are with respect to network ground terminal.
(3)
Estimated when mounted on high K JEDEC board per JESD 51-7 with thickness of 1.6 mm, 4 layers, size of 76.2 mm X 114.3 mm, and
2 oz. copper for top and bottom plane. Actual thermal impedance will depend on PCB used in the application.
(4)
It is recommended that copper plane in proper size on board be in contact with die thermal pad to dissipate heat efficiently. Thermal pad
is electrically connected to PBKG, which is supposed to be tied to the output of buck-boost converter. Thus wide copper trace in the
buck-boost output will help heat dissipated efficiently.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
Input voltage range at VIN, VIN_P, VIN3P3
3
3.7
6
V
Voltage range at SDA, SCL, WAKEUP, PWRUP, VCOM_CTRL,
0
3.6
V
VDDH_FB, VEE_FB, PWR_GOOD, nINT
TA
Operating ambient temperature range
–10
85
°C
TJ
Operating junction temperature range
–10
125
°C
Copyright
2011, Texas Instruments Incorporated
5
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