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參數(shù)資料
| 型號： | TPS3307-33Y |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | TRIPLE PROCESSOR SUPERVISORS |
| 中文描述： | 三重處理器監(jiān)事 |
| 文件頁數(shù)： | 10/14頁 |
| 文件大?。?/td> | 430K |
| 代理商： | TPS3307-33Y |
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
SOIC
Package
Drawing
D
Pins Package
Qty
75
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
TPS3307-18D
ACTIVE
8
Pb-Free
(RoHS)
None
CU NIPDAU
Level-2-260C-1YEAR/
Level-1-220C-UNLIM
Level-1-220C-UNLIM
TPS3307-18DGN
ACTIVE
MSOP-
Power
PAD
MSOP-
Power
PAD
SOIC
DGN
8
80
CU NIPDAU
TPS3307-18DGNR
ACTIVE
DGN
8
2500
None
CU NIPDAU
Level-1-220C-UNLIM
TPS3307-18DR
ACTIVE
D
8
2500
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1YEAR/
Level-1-220C-UNLIM
Level-1-260C-UNLIM
TPS3307-18DRG4
PREVIEW
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
75
Pb-Free
(RoHS)
80
CU NIPDAU
TPS3307-25D
ACTIVE
SOIC
D
8
CU NIPDAU
Level-2-260C-1YEAR/
Level-1-220C-UNLIM
Level-1-220C-UNLIM
TPS3307-25DGN
ACTIVE
MSOP-
Power
PAD
MSOP-
Power
PAD
MSOP-
Power
PAD
SOIC
DGN
8
None
CU NIPDAU
TPS3307-25DGNR
ACTIVE
DGN
8
2500
None
CU NIPDAU
Level-1-220C-UNLIM
TPS3307-25DGNRG4
ACTIVE
DGN
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS3307-25DR
ACTIVE
D
8
2500
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1YEAR/
Level-1-220C-UNLIM
Level-1-260C-UNLIM
TPS3307-25DRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
75
80
CU NIPDAU
TPS3307-33D
TPS3307-33DGN
ACTIVE
ACTIVE
SOIC
MSOP-
Power
PAD
MSOP-
Power
PAD
SOIC
SOIC
D
8
8
None
None
CU NIPDAU
CU NIPDAU
Level-1-220C-UNLIM
Level-1-220C-UNLIM
DGN
TPS3307-33DGNR
ACTIVE
DGN
8
2500
None
CU NIPDAU
Level-1-220C-UNLIM
TPS3307-33DR
TPS3307-33DRG4
ACTIVE
ACTIVE
D
D
8
8
2500
2500 Green (RoHS &
no Sb/Br)
None
CU NIPDAU
CU NIPDAU
Level-1-220C-UNLIM
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check
for the latest availability information and additionalproduct content details.
None:
Not yet available Lead (Pb-Free).
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
PACKAGE OPTION ADDENDUM
www.ti.com
4-Mar-2005
Addendum-Page 1
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