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參數(shù)資料
| 型號： | TPA5050_07 |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | STEREO DIGITAL AUDIO LIP-SYNC DELAY WITH I2C CONTROL |
| 中文描述： | 立體聲數(shù)字音頻口形同步延遲與I2C控制 |
| 文件頁數(shù)： | 3/21頁 |
| 文件大?。?/td> | 782K |
| 代理商： | TPA5050_07 |
www.ti.com
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature (unless otherwise noted)
(1)
DISSIPATION RATINGS
(1)
RECOMMENDED OPERATING CONDITIONS
TPA5050
SLOS492B–MAY 2006–REVISED MAY 2007
VALUE
–0.3 to 3.6
–0.3 to 5.5
–0.3 to VDD+0.3
See Dissipation Rating Table
–40 to 85
–40 to 125
–65 to 125
260
UNIT
V
V
V
DD
Supply voltage
DATA, LRCLK, BCLK, SCL, SDA
ADD[2:0]
V
I
Input voltage
Continuous total power dissipation
Operating free-air temperature range
Operating junction temperature range
Storage temperature range
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
T
A
T
J
T
stg
°
C
°
C
°
C
°
C
(1)
Stresses beyond those listed under
absolute maximum ratings
may cause permanent damage to the device. These are stress ratings
only, and functional operations of the device at these or any other conditions beyond those indicated under
recommended operating
conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
PACKAGE
T
≤
25
°
C
POWER RATING
2.5 W
DERATING
FACTOR
25mW/
°
C
T
= 70
°
C
POWER RATING
1.375 W
T
= 85
°
C
POWER RATING
1.0 W
RSA
(1)
This data was taken using 1 oz trace and copper pad that is soldered directly to a JEDEC standard high-k PCB. The thermal pad must
be soldered to a thermal land on the printed-circuit board. See TI Technical Briefs
SCBA017
D and
SLUA271
for more information about
using the QFN thermal pad.
MIN
MAX
3.6
UNIT
V
V
V
°
C
V
DD
V
IH
V
IL
T
A
Supply voltage
High-level input voltage
Low-level input voltage
Operating free-air temperature
VDD
DATA, LRCLK, BCLK, SCL, SDA, ADD[2:0]
DATA, LRCLK, BCLK, SCL, SDA, ADD[2:0]
3
2
0.8
85
–40
3
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