參數(shù)資料
型號(hào): TPA3130D2DAPR
廠商: Texas Instruments
文件頁(yè)數(shù): 20/35頁(yè)
文件大?。?/td> 0K
描述: IC AMP AUD PWR 15W STER 32HTSSOP
標(biāo)準(zhǔn)包裝: 2,000
系列: SpeakerGuard™
類型: D 類
輸出類型: 2 通道(立體聲)
在某負(fù)載時(shí)最大輸出功率 x 通道數(shù)量: 15W x 2 @ 8 歐姆
電源電壓: 4.5 V ~ 26 V
特點(diǎn): 差分輸入,靜音,短路和熱保護(hù),關(guān)機(jī)
安裝類型: 表面貼裝
供應(yīng)商設(shè)備封裝: 32-HTSSOP
封裝/外殼: 32-TSSOP(0.240",6.10mm 寬)裸露焊盤
包裝: 帶卷 (TR)
PACKAGE OPTION ADDENDUM
www.ti.com
11-Nov-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C)
Device Marking
(4/5)
Samples
TPA3116D2DAD
ACTIVE
HTSSOP
DAD
32
46
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
TPA
3116
D2
TPA3116D2DADR
ACTIVE
HTSSOP
DAD
32
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
TPA
3116
D2
TPA3118D2DAP
ACTIVE
HTSSOP
DAP
32
46
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
TPA3118
TPA3118D2DAPR
ACTIVE
HTSSOP
DAP
32
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
TPA3118
TPA3130D2DAP
ACTIVE
HTSSOP
DAP
32
46
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
TPA3130
TPA3130D2DAPR
ACTIVE
HTSSOP
DAP
32
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
TPA3130
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
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