參數(shù)資料
型號(hào): TPA2010D1YZF
廠商: Texas Instruments, Inc.
英文描述: 2.5-W MONO FILTER-FREE CLASS-D AUDIO POWER AMPLIFIER
中文描述: 2.5單聲道無(wú)濾波器D類音頻功率放大器
文件頁(yè)數(shù): 16/23頁(yè)
文件大?。?/td> 415K
代理商: TPA2010D1YZF
SLOS417A OCTOBER 2003 REVISED DECEMBER 2003
www.ti.com
16
Component Location
Place all the external components very close to the TPA2010D1. The input resistors need to be very close to
the TPA2010D1 input pins so noise does not couple on the high impedance nodes between the input resistors
and the input amplifier of the TPA2010D1. Placing the decoupling capacitor, C
S
, close to the TPA2010D1 is
important for the efficiency of the class-D amplifier. Any resistance or inductance in the trace between the device
and the capacitor can cause a loss in efficiency.
Trace Width
Recommended trace width at the solder balls is 75
μ
m to 100
μ
m to prevent solder wicking onto wider PCB
traces. Figure 34 shows the layout of the TPA2010D1 evaluation module (EVM).
For high current pins (V
DD
, GND V
O+
, and V
O
) of the TPA2010D1, use 100-
μ
m trace widths at the solder balls
and at least 500-
μ
m PCB traces to ensure proper performance and output power for the device.
For input pins (IN, IN+, and SHUTDOWN) of the TPA2010D1, use 75-
μ
m to 100-
μ
m trace widths at the solder
balls. IN and IN+ pins need to run side-by-side to maximize common-mode noise cancellation. Placing input
resistors, R
IN
, as close to the TPA2010D1 as possible is recommended.
375 m
(+0, 25 m)
275 m
(+0, 25 m)
Circular Solder Mask Opening
Paste Mask (Stencil)
= Copper Pad Size
75 m
100 m
100 m
100 m
100 m
100 m
75 m
75 m
Figure 34. Close Up of TPA2010D1 Land Pattern From TPA2010D1 EVM
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