參數(shù)資料
型號(hào)： TPA2010D1YZF
廠商： Texas Instruments, Inc.
英文描述： 2.5-W MONO FILTER-FREE CLASS-D AUDIO POWER AMPLIFIER
中文描述： 2.5單聲道無(wú)濾波器D類(lèi)音頻功率放大器
文件頁(yè)數(shù)： 15/23頁(yè)
文件大?。?/td> 415K
代理商： TPA2010D1YZF
SLOS417A OCTOBER 2003 REVISED DECEMBER 2003
www.ti.com
15
BOARD LAYOUT
In making the pad size for the WCSP balls, it is recommended that the layout use nonsolder mask defined
(NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the
opening size is defined by the copper pad width. Figure 33 and Table 2 show the appropriate diameters for a
WCSP layout. The TPA2010D1 evaluation module (EVM) layout is shown in the next section as a layout
example.
Copper
Trace Width
Solder Mask
Thickness
Solder
Pad Width
Solder Mask
Opening
Copper Trace
Thickness
Figure 33. Land Pattern Dimensions
Table 2. Land Pattern Dimensions
SOLDER PAD
DEFINITIONS
COPPER PAD
SOLDER MASK
OPENING
375
μ
m
(+0.0, 25
μ
m)
COPPER
THICKNESS
1 oz max (32
μ
m)
STENCIL OPENING
STENCIL
THICKNESS
125
μ
m thick
Nonsolder mask
defined (NSMD)
275
μ
m
(+0.0, 25
μ
m)
275
μ
m x 275
μ
m Sq.
(rounded corners)
NOTES:A. Circuit traces from NSMD defined PWB lands should be 75
μ
m to 100
μ
m wide in the exposed area inside the solder mask opening. Wider
trace widths reduce device stand off and impact reliability.
NOTES:B. Recommend solder paste is Type 3 or Type 4.
NOTES:C. Best reilability results are achieved when the PWB laminate glass transition temperature is above the operating the range of the intended
application.
NOTES:D. For a PWB using a Ni/Au surface finish, the gold thickness should be less 0.5
μ
m to avoid a reduction in thermal fatigue performance.
NOTES:E. Solder mask thickness should be less than 20
μ
m on top of the copper circuit pattern.
NOTES:F. Best solder stencil preformance is achieved using laser cut stencils with electro polishing. Use of chemically etched stencils results in
inferior solder paste volume control.
NOTES:G. Trace routing away from WCSP device should be balanced in X & Y directions to avoid unintentional component movement due to solder
wetting forces.
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參數(shù)描述
TPA2010D1YZFR 功能描述:音頻放大器 Mono Filter-Free Class-D in WCSP RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TPA2010D1YZFRG4 制造商:TI 功能描述:AUDIO POWER AMPLIFIER
TPA2010D1YZFT 功能描述:音頻放大器 Mono Filter-Free Class-D in WCSP RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類(lèi)型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TPA2011D1 制造商:TI 制造商全稱(chēng):Texas Instruments 功能描述:3.2W Mono Filter-Free Class-D Audio Power Amplifier With Auto-Recovering Short-Circuit Protection
TPA2011D1_12 制造商:TI 制造商全稱(chēng):Texas Instruments 功能描述:3.2W Mono Filter-Free Class-D Audio Power Amplifier
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