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Contents
TMS320TCI6482
Communications Infrastructure Digital Signal Processor
SPRS246F–APRIL 2005–REVISED MAY 2007
1
Features
...................................................
1
1.1
1.2
1.3
Device Overview
.........................................
6
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
Device Configuration
..................................
54
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
System Interconnect
...................................
77
4.1
4.2
4.3
4.4
C64x+ Megamodule
....................................
83
5.1
5.2
5.3
5.4
5.5
5.6
5.7
Rake Search Accelerator (RSA)
.....................
98
7
Device Operating Conditions
........................
99
7.1
Absolute Maximum Ratings Over Operating Case
Temperature Range (Unless Otherwise Noted)
.....
99
7.2
7.3
Electrical Characteristics Over Recommended
Ranges of Supply Voltage and Operating Case
Temperature (Unless Otherwise Noted)
...........
101
C64x+ Peripheral Information and Electrical
Specifications
.........................................
103
8.1
8.2
Recommended Clock and Control Signal Transition
Behavior
............................................
105
8.3
8.4
Enhanced Direct Memory Access (EDMA3)
Controller
...........................................
107
8.5
8.6
8.7
8.8
8.9
8.10
8.11
8.12
8.13
8.14
8.15
8.16
8.17
8.18
8.19
8.20
8.21
8.22
8.23
Revision History
............................................
250
9
9.1
9.2
ZTZ/GTZ BGA Package (Bottom View)
..............
2
Description
............................................
2
Functional Block Diagram
............................
4
Recommended Operating Conditions
...............
99
2
Device Characteristics
................................
6
CPU (DSP Core) Description
.........................
7
Memory Map Summary
.............................
10
Boot Sequence
......................................
12
Pin Assignments
....................................
15
Signal Groups Description
..........................
19
Terminal Functions
..................................
25
Development
........................................
50
8
Parameter Information
.............................
103
Power Supplies
....................................
105
3
Interrupts
...........................................
121
Reset Controller
....................................
125
PLL1 and PLL1 Controller
.........................
133
PLL2 and PLL2 Controller
.........................
148
DDR2 Memory Controller
..........................
157
External Memory Interface A (EMIFA)
.............
159
I2C Peripheral
......................................
170
Host-Port Interface (HPI) Peripheral
...............
176
Multichannel Buffered Serial Port (McBSP)
........
187
Ethernet MAC (EMAC)
.............................
197
Timers
..............................................
215
Enhanced Viterbi-Decoder Coprocessor (VCP2)
..
217
Enhanced Turbo Decoder Coprocessor (TCP2)
...
218
Peripheral Component Interconnect (PCI)
.........
220
UTOPIA
............................................
227
Serial RapidIO (SRIO) Port
........................
231
VLYNQ Peripheral
.................................
243
General-Purpose Input/Output (GPIO)
.............
246
Emulation Features and Capability
................
248
Device Configuration at Device Reset
..............
54
Peripheral Configuration at Device Reset
...........
56
Peripheral Selection After Device Reset
............
58
Device State Control Registers
.....................
60
Device Status Register Description
.................
71
JTAG ID (JTAGID) Register Description
............
73
Pullup/Pulldown Resistors
...........................
74
Configuration Examples
.............................
75
4
Internal Buses, Bridges, and Switch Fabrics
........
77
Data Switch Fabric Connections
....................
78
Configuration Switch Fabric
.........................
80
Bus Priorities
........................................
82
5
Memory Architecture
................................
83
Memory Protection
..................................
86
Bandwidth Management
............................
86
Power-Down Control
................................
87
Megamodule Resets
................................
87
Megamodule Revision
...............................
88
C64x+ Megamodule Register Description(s)
........
89
Mechanical Data
.......................................
252
Thermal Data
......................................
252
Packaging Information
.............................
252
6
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