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參數資料
| 型號： | TMX320C6413ZTS500 |
| 廠商： | Texas Instruments, Inc. |
| 元件分類： | 數字信號處理 |
| 英文描述： | Fixed-Point Digital Signal Processors |
| 中文描述： | 定點數字信號處理器 |
| 文件頁數： | 85/140頁 |
| 文件大?。?/td> | 1958K |
| 代理商： | TMX320C6413ZTS500 |
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Power-Supply Sequencing
85
April 2004
Revised May 2005
SPRS247E
DV
DD
CV
DD
V
SS
C6000
DSP
Schottky
Diode
I/O Supply
Core Supply
GND
Figure 4
8. Schottky Diode Diagram
Core and I/O supply voltage regulators should be located close to the DSP (or DSP array) to minimize
inductance and resistance in the power delivery path. Additionally, when designing for high-performance
applications utilizing the C6000
platform of DSPs, the PC board should include separate power planes for
core, I/O, and ground, all bypassed with high-quality low-ESL/ESR capacitors.
TI DSPs do not require specific power sequencing between the core supply and the I/O supply. However,
systems should be designed to ensure that neither supply is powered up for extended periods of time if the
other supply is below the proper operating voltage.
4.8
Power-Supply Decoupling
In order to properly decouple the supply planes from system noise, place as many capacitors (caps) as
possible close to the DSP. Assuming 0603 caps, the user should be able to fit a total of 60 caps, 30 for the
core supply and 30 for the I/O supply. These caps need to be close to the DSP power pins, no more than
1.25 cm maximum distance to be effective. Physically smaller caps, such as 0402, are better because of their
lower parasitic inductance. Proper capacitance values are also important. Small bypass caps (near 560 pF)
should be closest to the power pins. Medium bypass caps (220 nF or as large as can be obtained in a small
package) should be next closest. TI recommends no less than 8 small and 8 medium caps per supply (32 total)
be placed immediately next to the BGA vias, using the “interior” BGA space and at least the corners of the
“exterior”.
Eight larger caps (4 for each supply) can be placed further away for bulk decoupling. Large bulk caps (on the
order of 100
μ
F) should be furthest away (but still as close as possible). No less than 4 large caps per supply
(8 total) should be placed outside of the BGA.
Any cap selection needs to be evaluated from a yield/manufacturing point-of-view. As with the selection of any
component, verification of capacitor availability over the product’s production lifetime should be considered.
相關PDF資料 |
PDF描述 |
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| TMP320C6413ZTS500 | Fixed-Point Digital Signal Processors |
| TMX320C6413ZTSA400 | Fixed-Point Digital Signal Processors |
| TMP320C6413ZTSA400 | Fixed-Point Digital Signal Processors |
| TMX320C6413GTS400 | Fixed-Point Digital Signal Processors |
| TMX320C6413GTS500 | Fixed-Point Digital Signal Processors |
相關代理商/技術參數 |
參數描述 |
|---|---|
| TMX320C6413ZTSA400 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:Fixed-Point Digital Signal Processors |
| TMX320C6413ZTSA500 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:Fixed-Point Digital Signal Processors |
| TMX320C6414CGLZ300 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:FIXED-POINT DIGITAL SIGNAL PROCESSORS |
| TMX320C6414CGLZ5 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| TMX320C6414CGLZ5E0 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:FIXED-POINT DIGITAL SIGNAL PROCESSORS |
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