參數(shù)資料
型號: TMS32C6411AGLZ
廠商: Texas Instruments, Inc.
元件分類: 數(shù)字信號處理
英文描述: FIXED POINT DIGITAL SIGNAL PROCESSOR
中文描述: 定點數(shù)字信號處理器
文件頁數(shù): 8/119頁
文件大?。?/td> 1742K
代理商: TMS32C6411AGLZ
SPRS196H MARCH 2002 REVISED JULY 2004
8
POST OFFICE BOX 1443
HOUSTON, TEXAS 772511443
device characteristics
Table 1 provides an overview of the C6411 DSP. The table shows significant features of the C6411 device,
including the capacity of on-chip RAM, the peripherals, the CPU frequency, and the package type with pin count.
Table 1. Characteristics of the C6411 Processor
HARDWARE FEATURES
INTERNAL CLOCK
SOURCE
C6411
Peripherals
EMIF (32-bit bus width)
ECLKIN
1
Not all peripherals pins are
(For more details, see the
Device Configuration
section.)
EDMA (64 independent channels)
CPU/2 Clock Frequency
1
HPI (32- or 16-bit user selectable)
CPU/4 Clock Frequency
1 (HPI16 or HPI32)
available at the same time.
PCI (32-bit)
PCLK
1
McBSPs (McBSP0 and McBSP1)
CPU/4 Clock Frequency
2
Peripheral performance is
dependent on chip-level
configuration.
32-Bit Timers
CPU/8 Clock Frequency
3
General-Purpose Input/Outputs
(GPIOs)
CPU/8 Clock Frequency
16
Size (Bytes)
288K
On-Chip Memory
Organization
16K-Byte (16KB) L1 Program (L1P)
Cache
16KB L1 Data (L1D) Cache
256KB Unified Mapped RAM/Cache (L2)
CPU ID + CPU Rev ID
Control Status Register (CSR.[31:16])
0x0C01
Device_ID
Silicon Revision Identification Register
(DEVICE_REV [19:16])
Address: 0x01B0 0200
DEVICE_REV[19:16]
0010 or 0000
0011
Silicon Revision
1.1
2.0
Frequency
MHz
300
Cycle Time
ns
3.33 ns
Voltage
Core (V)
1.2 V
I/O (V)
3.3 V
PLL Options
CLKIN frequency multiplier
Bypass (x1), x6
BGA Package
23 x 23 mm
μ
m
Product Preview (PP)
Advance Information (AI)
Production Data (PD)
(For more details on the C64x
DSP part numbering, see
Figure 5)
532-Pin BGA (GLZ and ZLZ)
0.13
μ
m
Process Technology
Product Status
PD (1.1, 2.0)
Device Part Numbers
TMS320C6411GLZ
TMS320C6411AGLZ
PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice.
ADVANCE INFORMATION concerns new products in the sampling or preproduction phase of development. Characteristic data and
other specifications are subject to change without notice.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
相關(guān)PDF資料
PDF描述
TMS32C6411AZLZ FIXED POINT DIGITAL SIGNAL PROCESSOR
TMS32C6411GLZ FIXED POINT DIGITAL SIGNAL PROCESSOR
TMS32C6411ZLZ FIXED POINT DIGITAL SIGNAL PROCESSOR
TMX320C6411AGLZ FIXED POINT DIGITAL SIGNAL PROCESSOR
TMX320C6411AZLZ FIXED POINT DIGITAL SIGNAL PROCESSOR
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TMS32C6414CGLZ5E0 制造商:Rochester Electronics LLC 功能描述:- Bulk
TMS32C6414CGLZ6E3 制造商:Rochester Electronics LLC 功能描述:LAPLACE REV 1.03, 600 MHZ, 133 MHZ EMIF - Bulk
TMS32C6414DGLZ5E0 功能描述:IC DSP FIXED-POINT 532-BGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP(數(shù)字式信號處理器) 系列:TMS320C6414T/15T/16T 標準包裝:2 系列:StarCore 類型:SC140 內(nèi)核 接口:DSI,以太網(wǎng),RS-232 時鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA,F(xiàn)CBGA 供應商設(shè)備封裝:431-FCPBGA(20x20) 包裝:托盤
TMS32C6414DGLZ7E3 功能描述:IC FIXED-POINT DSP 532-FCBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP(數(shù)字式信號處理器) 系列:TMS320C6414T/15T/16T 標準包裝:2 系列:StarCore 類型:SC140 內(nèi)核 接口:DSI,以太網(wǎng),RS-232 時鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA,F(xiàn)CBGA 供應商設(shè)備封裝:431-FCPBGA(20x20) 包裝:托盤
TMS32C6414DGLZA5E0 制造商:Rochester Electronics LLC 功能描述:LAPLACE EXTENDED TEMP (-40C TO 105C) - Bulk