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參數(shù)資料
| 型號： | TLV320AIC31IRHBTG4 |
| 廠商： | Texas Instruments |
| 文件頁數(shù)： | 75/84頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC STEREO AUDIO CODEC LP 32-VQFN |
| 標(biāo)準(zhǔn)包裝： | 250 |
| 類型： | 立體聲音頻 |
| 數(shù)據(jù)接口： | PCM 音頻接口 |
| 分辨率（位）： | 24 b |
| ADC / DAC 數(shù)量： | 2 / 2 |
| 三角積分調(diào)變： | 是 |
| S/N 比，標(biāo)準(zhǔn) ADC / DAC (db)： | 92 / 100 |
| 動態(tài)范圍，標(biāo)準(zhǔn) ADC / DAC (db)： | 92 / 100 |
| 電壓 - 電源，模擬： | 2.7 V ~ 3.6 V |
| 電壓 - 電源，數(shù)字： | 1.65 V ~ 1.95 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 32-VFQFN 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 32-QFN 裸露焊盤（5x5） |
| 包裝： | 帶卷 (TR) |
| 配用： | 296-19476-ND - KIT EVAL/DEMO FOR TLV320AIC31 296-19475-ND - MODULE EVAL FOR TLV320AIC31 |
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PACKAGE OPTION ADDENDUM
www.ti.com
27-Jul-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
Op Temp (°C)
Device Marking
(4/5)
Samples
TLV320AIC31IRHBR
NRND
VQFN
RHB
32
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
AIC31I
TLV320AIC31IRHBRG4
NRND
VQFN
RHB
32
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
AIC31I
TLV320AIC31IRHBT
NRND
VQFN
RHB
32
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
AIC31I
TLV320AIC31IRHBTG4
NRND
VQFN
RHB
32
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
AIC31I
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
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