參數(shù)資料
型號: TLV2211Y
廠商: Texas Instruments, Inc.
英文描述: Advanced LinCMOSE RAIL-TO-RAIL MICROPOWER SINGLE OPERATIONAL AMPLIFIERS
中文描述: 高級LinCMOSE軌至軌微功耗單運算放大器
文件頁數(shù): 3/29頁
文件大?。?/td> 529K
代理商: TLV2211Y
TLV2211, TLV2211Y
Advanced LinCMOS
RAIL-TO-RAIL
MICROPOWER SINGLE OPERATIONAL AMPLIFIERS
SLOS156B – MAY 1996 – REVISED JANUARY 1997
3
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TLV2211Y chip information
This chip, when properly assembled, displays characteristics similar to the TLV2211C. Thermal compression
or ultrasonic bonding may be used on the doped-aluminum bonding pads. This chip may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 10 MILS TYPICAL
BONDING PADS: 4
×
4 MILS MINIMUM
TJmax = 150
°
C
TOLERANCES ARE
±
10%.
ALL DIMENSIONS ARE IN MILS.
PIN (2) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
+
OUT
IN+
IN–
VDD+
(5)
(1)
(3)
(4)
(2)
VDD–/GND
40
(3)
(2)
(1)
(5)
(4)
32
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