- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄384989 > TLK2201I (Texas Instruments, Inc.) Circular Connector; MIL SPEC:MIL-C-5015; Body Material:Aluminum Alloy; Series:ACA-B Reverse Bayonet; No. of Contacts:7; Connector Shell Size:16S; Connecting Termination:Crimp; Circular Shell Style:Straight Plug; Gender:Female PDF資料下載
參數(shù)資料
| 型號： | TLK2201I |
| 廠商： | Texas Instruments, Inc. |
| 元件分類： | 圓形連接器 |
| 英文描述： | Circular Connector; MIL SPEC:MIL-C-5015; Body Material:Aluminum Alloy; Series:ACA-B Reverse Bayonet; No. of Contacts:7; Connector Shell Size:16S; Connecting Termination:Crimp; Circular Shell Style:Straight Plug; Gender:Female |
| 中文描述： | 以太網(wǎng)收發(fā)器 |
| 文件頁數(shù)： | 17/19頁 |
| 文件大?。?/td> | 263K |
| 代理商： | TLK2201I |
TLK2201, TLK2201I
ETHERNET TRANSCEIVERS
SLLS420C
–
JUNE 2000
–
REVISED NOVEMBER 2001
17
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
designing with PowerPAD
(continued)
It is recommended that there be a thermal land, which is an area of solder-tinned-copper, underneath the
PowerPAD package. The thermal land varies in size depending on the PowerPAD package being used, the PCB
construction, and the amount of heat that needs to be removed. In addition, the thermal land may or may not
contain numerous thermal vias depending on PCB construction.
Other requirements for thermal lands and thermal vias are detailed in the TI application note
PowerPAD
Thermally Enhanced Package Application Report
, TI literature number SLMA002, available via the TI Web
pages beginning at URL:
http://www.ti.com.
Figure 13. Example of a Thermal Land
For the TLK2201, this thermal land must be grounded to the low-impedance ground plane of the device. This
improves not only thermal performance but also the electrical grounding of the device. It is also recommended
that the device ground pin landing pads be connected directly to the grounded thermal land. The land size must
be as large as possible without shorting device signal pins. The thermal land may be soldered to the exposed
PowerPAD using standard reflow soldering techniques.
While the thermal land may be electrically floated and configured to remove heat to an external heat sink,
it is
recommended
that the thermal land be connected to the low-impedance ground plane for the device. More
information may be obtained from the TI application note
PHY Layout
, TI literature number SLLA020.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TLLY440 | Multipole, Connector, Mounting Type Pin, Pole Count 10 |
| TLLG440 | Low Current LED in ?3 mm Tinted Diffused Package |
| TLLR440 | Low Current LED in ?3 mm Tinted Diffused Package |
| TLLY540 | Low Current LED in ?5 mm Tinted Diffused Package |
| TLLG540 | Low Current LED in ?5 mm Tinted Diffused Package |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TLK2201IRCP | 功能描述:以太網(wǎng) IC 1.0 to 1.6 Gbps Gb Ethernet Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Ethernet Switches 收發(fā)器數(shù)量:2 數(shù)據(jù)速率:10 Mb/s, 100 Mb/s 電源電壓-最大:1.25 V, 3.45 V 電源電壓-最小:1.15 V, 3.15 V 最大工作溫度:+ 85 C 封裝 / 箱體:QFN-64 封裝:Tray |
| TLK2201IRCPG4 | 功能描述:以太網(wǎng) IC 1.0 to 1.6 Gbps Gb Ethernet Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Ethernet Switches 收發(fā)器數(shù)量:2 數(shù)據(jù)速率:10 Mb/s, 100 Mb/s 電源電壓-最大:1.25 V, 3.45 V 電源電壓-最小:1.15 V, 3.15 V 最大工作溫度:+ 85 C 封裝 / 箱體:QFN-64 封裝:Tray |
| TLK2201JR | 制造商:TI 制造商全稱:Texas Instruments 功能描述:1.0 Gb to 1.6 Gb SMALL FORM-FACTOR ETHERNET TRANSCEIVER |
| TLK2201JRGQE | 功能描述:以太網(wǎng) IC 1.0 to 1.6 Gbps Gb Ethernet Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Ethernet Switches 收發(fā)器數(shù)量:2 數(shù)據(jù)速率:10 Mb/s, 100 Mb/s 電源電壓-最大:1.25 V, 3.45 V 電源電壓-最小:1.15 V, 3.15 V 最大工作溫度:+ 85 C 封裝 / 箱體:QFN-64 封裝:Tray |
| TLK2201JRZQE | 制造商:Texas Instruments 功能描述:1.0 TO 1.6 GIGABIT ETHERNET TRANSCEIVER - Trays |
發(fā)布緊急采購，3分鐘左右您將得到回復。