參數(shù)資料
型號(hào)： TLK2201I
廠商： Texas Instruments, Inc.
元件分類(lèi)： 圓形連接器
英文描述： Circular Connector; MIL SPEC:MIL-C-5015; Body Material:Aluminum Alloy; Series:ACA-B Reverse Bayonet; No. of Contacts:7; Connector Shell Size:16S; Connecting Termination:Crimp; Circular Shell Style:Straight Plug; Gender:Female
中文描述： 以太網(wǎng)收發(fā)器
文件頁(yè)數(shù)： 10/19頁(yè)
文件大小： 263K
代理商： TLK2201I
TLK2201, TLK2201I
ETHERNET TRANSCEIVERS
SLLS420C
–
JUNE 2000
–
REVISED NOVEMBER 2001
10
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
Terminal Functions (Continued)
TERMINAL
I/O
DESCRIPTION
NAME
NO.
GROUND
GNDA
51,58
Ground
Analog ground. GNDA provides a ground for the high-speed analog circuits, RX and TX.
GND
1, 14, 21,
25, 33, 46
Ground
Digital logic ground. Provides a ground for the logic circuits and digital I/O buffers.
GNDPLL
64
Ground
PLL ground. Provides a ground for the PLL circuitry.
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Supply voltage, V
DD
(see Note 1)
Input voltage, V
I
, (TTL)
DC input voltage (I/O )
Voltage range at any terminal
Storage temperature, T
stg
Electrostatic discharge
Characterized free-air operating temperature range: TLK2201
–
0.3 V to 3 V
–
0.5 V to 4 V
–
0.3 V to 3 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
–
0.3 V to V
DD
+0.3 V
–
65
°
C to 150
°
C
HBM:2 kV, CDM: 1 kV
0
°
C to 70
°
C
–
40
°
C to 85
°
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . .
TLK2201I
Stresses beyond those listed under
“
absolute maximum ratings
”
may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under
“
recommended operating conditions
”
is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
DISSIPATION RATING TABLE
OPERATING FACTOR
ABOVE TA = 25
°
C
5.25 W
46.58 mW/
°
C
3.17 W
23.70 mW/
°
C
2.01 W
13.19 mW/
°
C
PACKAGE
TA
≤
25
°
C
POWER RATING
TA = 70
°
C
POWER RATING
RCP64
§
RCP64
RCP64#
2.89 W
1.74 W
1.11 W
This is the inverse of the traditional junction-to-ambient thermal resistance (R
θ
JA).
§
2 oz. Trace and copper pad with solder.
2 oz. Trace and copper pad without solder.
#Standard JEDEC high-K board
NOTE: For more information, refer to TI application note
PowerPAD Thermally Enhanced
Package,
TI literature number SLMA002.
thermal characteristics
PARAMETER
TEST CONDITION
MIN
TYP
MAX
UNIT
Board-mounted, no air flow, high conductivity TI
recommended test board, chip soldered or greased to
thermal land
Board-mounted, no air flow, high conductivity TI
recommended test board with thermal land but no
solder or grease thermal connection to thermal land
Board-mounted, no air flow, JEDEC test board
Board-mounted, no air flow, high conductivity TI
recommended test board, chip soldered or greased to
thermal land
Board-mounted, no air flow, high conductivity TI
recommended test board with thermal land but no
solder or grease thermal connection to thermal land
Board-mounted, no air flow, JEDEC test board
21.47
R
θ
JA
Junction-to-free-air thermal resistance
42.20
°
C/W
75.83
0.38
R
θ
JC
Junction-to-case-thermal resistance
0.38
°
C/W
7.8
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TLK2201IRCPG4 功能描述:以太網(wǎng) IC 1.0 to 1.6 Gbps Gb Ethernet Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Ethernet Switches 收發(fā)器數(shù)量:2 數(shù)據(jù)速率:10 Mb/s, 100 Mb/s 電源電壓-最大:1.25 V, 3.45 V 電源電壓-最小:1.15 V, 3.15 V 最大工作溫度:+ 85 C 封裝 / 箱體:QFN-64 封裝:Tray
TLK2201JR 制造商:TI 制造商全稱(chēng):Texas Instruments 功能描述:1.0 Gb to 1.6 Gb SMALL FORM-FACTOR ETHERNET TRANSCEIVER
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TLK2201JRZQE 制造商:Texas Instruments 功能描述:1.0 TO 1.6 GIGABIT ETHERNET TRANSCEIVER - Trays
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