參數(shù)資料
型號: TLE8262-2E
廠商: Infineon Technologies
文件頁數(shù): 13/16頁
文件大?。?/td> 0K
描述: IC SYSTEM BASIS CHIP DSO-36
標準包裝: 1,000
類型: 收發(fā)器
應用: 自動
安裝類型: 表面貼裝
封裝/外殼: 36-BSSOP(0.295",7.50mm 寬)裸露焊盤
供應商設備封裝: PG-DSO-36
包裝: 帶卷 (TR)
其它名稱: SP000454468
ESD Robustness of TLE6251DS in comparison with the competition
ESD robustness: holding the leadership in performance and innovation
O NE OF T h E S PE CIFIC C h ALLENGE S for a transceiver device is to withstand the harsh signals that occur on
the bus, from ESD (Electro Static Discharges) to voltage peaks resulting from the parasitic inductances of bus cables. A robust
transceiver also does not need expensive external protection components such a zener diodes or varistors.
O VE r T h E P AS T y EA r S Infineon developed and improved an innovative integrated protection that enables the
dissipation of the energy, which is converted during an ESD event, through the chip from top to bottom. Silicon On Isolator (SOI)
type technologies where the active side of the chip is decoupled from its bottom by an insulator do not allow such concepts.
Infineons products can hold more than 10 kVolts of discharges using ISO 61000-4-2 test standard, an application oriented testing
method that applies an energy which is five times higher than the standard hBM (human Body Model) test that simulates typical
handling events.
6
Competition
Infineon TLE7259-2G
M
ax
imum
ESD
di
sc
har
ge
re
si
st
anc
e
at
bu
s
pin
s
(kV)
ISO 61000-4-2 150 pF / 330 T
(without bus filter)
ISO 61000-4-2 150 pF / 330 T
(with bus filter C = 3.3 nF)
+1 kV
+15 kV
+1 kV
+15 kV
Competition
Infineon TLE6251DS
M
ax
imum
ESD
di
sc
har
ge
re
si
st
anc
e
at
bu
s
pin
s
(kV)
ISO 61000-4-2 150 pF / 330 T
ISO 61000-4-2 150 pF / 2 kT
+2 kV
+10 kV
+1,5 kV
+13 kV
ESD Robustness of TLE7259-2G in comparison with the competition
08-01-16 RZ Transceiver Gesamt.indd 6
16.01.2008 12:23:30 Uhr
相關PDF資料
PDF描述
TMPA910CRAXBG IC MCU 32BIT ARM9 W/ADC 361FBGA
TMS320C6205GHKA200 IC FIXED-POINT DSP 288-BGA
TMS320C6415TBGLZA7 IC FIXED-POINT DSP 532-FCBGA
TMS320DM647ZUT7 IC DGTL MEDIA PROC 529-FCBGA
TMS320VC5409GGU100 IC DIG SIG PROCESSOR 144-BGA
相關代理商/技術參數(shù)
參數(shù)描述
TLE82622EFUMA1 制造商:Infineon Technologies AG 功能描述:IC SYSTEM BASIS CHIP DSO-36
TLE82622EXUMA1 制造商:Infineon Technologies AG 功能描述:BODY SYSTEM ICS - Tape and Reel
TLE82622EXUMA2 制造商:Infineon Technologies AG 功能描述:BODY SYSTEM ICS - Tape and Reel 制造商:Infineon Technologies AG 功能描述:Universal System Basis Chip
TLE8262E 功能描述:CAN 接口集成電路 BODY SYSTEM ICS RoHS:否 制造商:Texas Instruments 類型:Transceivers 工作電源電壓:5 V 電源電流: 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:SOIC-8 封裝:Tube
TLE8262EXUMA1 功能描述:CAN 接口集成電路 BODY SYSTEM ICS RoHS:否 制造商:Texas Instruments 類型:Transceivers 工作電源電壓:5 V 電源電流: 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:SOIC-8 封裝:Tube
<em id="gjcyn"><sup id="gjcyn"></sup></em>