- 您現(xiàn)在的位置：買(mǎi)賣(mài)IC網(wǎng) > PDF目錄1970 > TLE8262-2E (Infineon Technologies)IC SYSTEM BASIS CHIP DSO-36 PDF資料下載
參數(shù)資料
| 型號(hào)： | TLE8262-2E |
| 廠商： | Infineon Technologies |
| 文件頁(yè)數(shù)： | 12/16頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC SYSTEM BASIS CHIP DSO-36 |
| 標(biāo)準(zhǔn)包裝： | 1,000 |
| 類(lèi)型： | 收發(fā)器 |
| 應(yīng)用： | 自動(dòng) |
| 安裝類(lèi)型： | 表面貼裝 |
| 封裝/外殼： | 36-BSSOP（0.295"，7.50mm 寬）裸露焊盤(pán) |
| 供應(yīng)商設(shè)備封裝： | PG-DSO-36 |
| 包裝： | 帶卷 (TR) |
| 其它名稱(chēng)： | SP000454468 |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)當(dāng)前第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)
robust Package: for a safer lead-free processing
AN ELEMENT OF ThE A uT OMO TIVE Ex C ELLENC E PrOGrAM, the robust package, significantly improves
the reliability of both, the component and the application. This new package concept enables Infineon to address the lead-free
requirements with improved quality, going beyond the today’s AEC Q101 specifications.
5
Green and Robust package
Robust package
Scanning acoustic microscope, ultrasonic images of the front, delamination in red (major) / yellow (minor)
Stress test: Temperature Cycling (– 55 °C, + 150 °C)
Preconditioning:
3 times solder reflow profile, 260 °C peak temp.
Stress test: Autoclave (Temp. 121 °C, 100 % humidity)
Preconditioning:
3 times solder reflow profile, 260 °C peak temp.
Competition
Infineon Green & robust,
SPT Technology
Competition
Infineon Green & robust,
SPT Technology
Solder Die Attach (PbSnAg)
allowing increased solder
reflow (260 °C) due to
green requirement
Robust Passivation
reducing passivation
cracks and shifted
metallisation
Adhesion promoter
providing good adhesion
to all interfaces
Low Stress / Molding Compound MC
halogen free
reducing thermomechanical
stress in package
Plating
lead free
08-01-16 RZ Transceiver Gesamt.indd 5
16.01.2008 12:23:29 Uhr
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TMPA910CRAXBG | IC MCU 32BIT ARM9 W/ADC 361FBGA |
| TMS320C6205GHKA200 | IC FIXED-POINT DSP 288-BGA |
| TMS320C6415TBGLZA7 | IC FIXED-POINT DSP 532-FCBGA |
| TMS320DM647ZUT7 | IC DGTL MEDIA PROC 529-FCBGA |
| TMS320VC5409GGU100 | IC DIG SIG PROCESSOR 144-BGA |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TLE82622EFUMA1 | 制造商:Infineon Technologies AG 功能描述:IC SYSTEM BASIS CHIP DSO-36 |
| TLE82622EXUMA1 | 制造商:Infineon Technologies AG 功能描述:BODY SYSTEM ICS - Tape and Reel |
| TLE82622EXUMA2 | 制造商:Infineon Technologies AG 功能描述:BODY SYSTEM ICS - Tape and Reel 制造商:Infineon Technologies AG 功能描述:Universal System Basis Chip |
| TLE8262E | 功能描述:CAN 接口集成電路 BODY SYSTEM ICS RoHS:否 制造商:Texas Instruments 類(lèi)型:Transceivers 工作電源電壓:5 V 電源電流: 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:SOIC-8 封裝:Tube |
| TLE8262EXUMA1 | 功能描述:CAN 接口集成電路 BODY SYSTEM ICS RoHS:否 制造商:Texas Instruments 類(lèi)型:Transceivers 工作電源電壓:5 V 電源電流: 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:SOIC-8 封裝:Tube |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。