參數(shù)資料
型號： THS5641ADW
廠商： Texas Instruments, Inc.
英文描述： 8-BIT, 100 MSPS, CommsDACE DIGITAL-TO-ANALOG CONVERTER
中文描述： 8位，100 MSPS的，CommsDACE數(shù)字模擬轉(zhuǎn)換器
文件頁數(shù)： 3/28頁
文件大?。?/td> 703K
代理商： THS5641ADW
THS5641A
8-BIT, 100 MSPS, CommsDAC
DIGITAL-TO-ANALOG CONVERTER
SLAS277 –MARCH 2000
3
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
Terminal Functions
TERMINAL
I/O
DESCRIPTION
NAME
AGND
NO.
20
I
Analog ground return for the internal analog circuitry
AVDD
BIASJ
24
I
Positive analog supply voltage (3 V to 5.5 V)
18
O
Full-scale output current bias
CLK
28
I
External clock input. Input data latched on rising edge of the clock.
Compensation and decoupling node, requires a 0.1
μ
F capacitor to AVDD.
Internal bias node, requires a 0.1
μ
F decoupling capacitor to AGND.
Data bits 0 through 7.
D7 is most significant data bit (MSB), D0 is least significant data bit (LSB).
COMP1
19
I
COMP2
23
I
D[7:0]
[1:8]
I
DGND
26
I
Digital ground return for the internal digital logic circuitry
DVDD
EXTIO
27
I
Positive digital supply voltage (3 V to 5.5 V)
17
I/O
Used as external reference input when internal reference is disabled (i.e., EXTLO = AVDD). Used as internal
reference output when EXTLO = AGND, requires a 0.1
μ
F decoupling capacitor to AGND when used as reference
output
EXTLO
16
O
Internal reference ground. Connect to AVDD to disable the internal reference source
DAC current output. Full scale when all input bits are set 1
IOUT1
22
O
IOUT2
21
O
Complementary DAC current output. Full scale when all input bits are 0
MODE
25
I
Mode select. Internal pulldown. Mode 0 is selected if this pin is left floating or connected to DGND. See
timing diagram.
NC
[9:14]
N
No connection
Asynchronous hardware power down input. Active High. Internal pulldown. Requires 5
μ
s to power down but 3 ms
to power up.
SLEEP
15
I
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Supply voltage range, AV
DD
(see Note 1)
–0.3 V to 6.5 V
–0.3 V to 6.5 V
–0.3 V to 0.5 V
–6.5 V to 6.5 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CLK, SLEEP, MODE (see Note 2)
Digital input D7–D0 (see Note 2)
IOUT1, IOUT2 (see Note 1)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
COMP1, COMP2 (see Note 1)
. . . . . . . . . . . . . . . . . . . . . . . . .
EXTIO, BIASJ (see Note 1)
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
EXTLO (see Note 1)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Peak input current (any input)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Peak total input current (all inputs)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating free-air temperature range, T
A
: THS5641AI
Storage temperature range
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from the case for 10 seconds
DV
DD
(see Note 2)
Voltage between AGND and DGND
Supply voltage range, AV
DD
to DV
DD
–0.3 V to DV
DD
+ 0.3 V
–0.3 V to DV
DD
+ 0.3 V
–1 V to AV
DD
+ 0.3 V
–0.3 V to AV
DD
+ 0.3 V
–0.3 V to AV
DD
+ 0.3 V
–0.3 V to 0.3 V
. . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . .
20 mA
–30 mA
–40
°
C to 85
°
C
–65
°
C to 150
°
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
260
°
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. Measured with respect to AGND.
2. Measured with respect to DGND.
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