參數(shù)資料
型號: THS3092DR
廠商: Texas Instruments, Inc.
英文描述: HIGH-VOLTAGE, LOW-DISTORTION, CURRENT-FEEDBACK OPERATIONAL AMPLIFIERS
中文描述: 高壓,低失真,電流反饋運算放大器
文件頁數(shù): 2/34頁
文件大小: 1605K
代理商: THS3092DR
www.ti.com
1
2
3
4
8
7
6
5
1V
OUT
1V
IN
1V
IN+
V
S
V
S+
2V
OUT
2V
IN
2V
IN+
D, DDA
TOP VIEW
THS3092
NC = No Internal Connection
D, PWP
TOP VIEW
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1V
OUT
1V
IN
1V
IN+
V
S
V
S+
2V
OUT
2V
IN
2V
IN+
NC
PD
NC
NC = No Internal Connection
See Note A.
THS3096
NC
REF
NC
Note A: The devices with the power down option defaults to the ON state if no signal is applied to the PD pin. Additionallly, the REF pin
functional range is from V
S
to (V
S+
4 V).
DISSIPATION RATING TABLE
THS3092
THS3096
SLOS428A–DECEMBER 2003–REVISED FEBRUARY 2004
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
PART NUMBER
THS3092D
THS3092DR
THS3092DDA
THS3092DDAR
Power-down
THS3096D
THS3096DR
THS3096PWP
THS3096PWPR
PACKAGE TYPE
TRANSPORT MEDIA, QUANTITY
Rails, 75
Tape and Reel, 2500
Rails, 75
Tape and Reel, 2500
SOIC-8
SOIC-8-PP
(1)
Rails, 75
SOIC-8
Tape and Reel, 2500
Rails, 90
Tape and Reel, 2000
TSSOP-14-PP
(1)
(1)
The PowerPAD is electrically isolated from all other pins.
POWER RATING
(2)
PACKAGE
Θ
JC
(
°
C/W)
Θ
JA
(
°
C/W)
(1)
T
A
25
°
C
1.02 W
2.18 W
2.67 W
T
A
= 85
°
C
410 mW
873 mW
1.07 W
D-8
38.3
9.2
2.07
97.5
45.8
37.5
DDA-8
(3)
PWP-14
(3)
(1)
(2)
This data was taken using the JEDEC standard High-K test PCB.
Power rating is determined with a junction temperature of 125
°
C. This is the point where distortion starts to substantially increase.
Thermal management of the final PCB should strive to keep the junction temperature at or below 125
°
C for best performance and long
term reliability.
The THS3092 and THS3096 may incorporate a PowerPAD on the underside of the chip. This acts as a heatsink and must be
connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction
temperature which could permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the
PowerPAD thermally enhanced package.
(3)
2
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