參數(shù)資料
型號: THS10064EVM
廠商: Texas Instruments, Inc.
英文描述: THS10064 Evaluation Module(THS10064評估模塊)
中文描述: THS10064評估模塊(THS10064評估模塊)
文件頁數(shù): 20/28頁
文件大?。?/td> 662K
代理商: THS10064EVM
Bill of Materials
3-5
Physical Description
3.2
Bill of Materials
Table 3
1 lists the components used in constructing the EVM.
Table 3
1.Bill of Materials
Quantity
Reference
Description
Manufacturer
8
C1
C3, C5
C7, C20
C21
1 nF, SMD, size 0805
MIRA-Electronic:8231/102
13
C4, C8
C19
10
μ
F Tantalum, C-Case
B
ü
rklin: 25 D 1046
7
L1
L4, L6
L8
10
μ
H, size 1206
B
ü
rklin: 76 D 470
1
L5
470
μ
H, size
B
ü
rklin: 74 D 4742
15
R1, R3, R5, R8
R11, R13,
R15, R18
R20, R25, R27, R28
49.9
, size 0805
MIRA
Electronic: 8132/49.9
2
R23, R24
0
, size 0805
11
R2, R4, R6, R7, R12, R14,
R16, R17, R21, R22, R26
10 k
, size 0805
MIRA-Electronic: 8132/10 k
1
IC1
THS1206CDA
Bereitstellung von TI
1
IC2
AD8044AR
Sp
rle
1
IC3
TPS7250QD
Bereitstellung von TI
1
IC4
TPS7233QD
Bereitstellung von TI
1
IC5
SN74AHC1G04DBVR
Bereitstellung von TI
1
IC6
SN74AHC1G02DBVR
Bereitstellung von TI
7
ADIFF, AINM, AINP,
BDIFF, BINM, BINP, EXT-CLK
BNC
B
ü
rklin: 78F2475
1
D1
1N4004
B
ü
rklin: 26 S 7950
14
AVDD, DGND, DVDD, SUPPLY,
TPA1
TPA5, TPD1
TPD5
Test point
B
ü
rklin: 07 F 810
1
AGND
PB4 black
B
ü
rklin: 35 F 234
1
VDD
PB4 red
B
ü
rklin: 35 F 236
2
T1, T2
Transformer: T1-6T-KK81
Municom
7
J1, J2, J5
J7, J12, J13
Jumper 3 pole
Riebensahm : 0100125112003
2
J10, J11
Jumper 2 pole
Riebensahm : 0100125112002
2
J6, J7 (HD
DSP)
SMD-Connector
Samtec: TFM-140-32-S-D-LC
12
1, 3, J14, J20
J24,
J100, J101, J103, TEST
Jumper 2 x 18 pole
2
J3, J4
Jumper 2 x 3 pole
1
J8
Jumper 2 x 5 pole
1
J9
Jumper 2 x 18 pole
May be replaced with THS12082, THS10082, THS10064
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