參數(shù)資料
型號: TEA1099
廠商: NXP Semiconductors N.V.
英文描述: Speech and handsfree IC with auxiliary inputs/outputs and analog multiplexer
中文描述: 語音輔助輸入和免提集成電路/輸出和模擬多路復用器
文件頁數(shù): 15/40頁
文件大?。?/td> 185K
代理商: TEA1099
1999 Apr 08
15
Philips Semiconductors
Product specification
Speech and handsfree IC with auxiliary
inputs/outputs and analog multiplexer
TEA1099H
The buffer amplifiers which apply the compressed signals
to TENV and RENV have a maximum source current of
120
μ
A and a maximum sink current of 1
μ
A. Together with
the capacitor C
TENV
and C
RENV
, the timing of the signal
envelope monitors can be set. In the basic application, the
value of both capacitors is 470 nF. Because of the
logarithmic compression, each 6 dB signal increase
means 18 mV increase of the voltage on the envelopes
TENV or RENV at room temperature. Thus, timings can be
expressed in dB/ms. At room temperature, the 120
μ
A
sourced current corresponds to a maximum rise-slope of
the signal envelope of 85 dB/ms. This is sufficient to track
normal speech signals. The 1
μ
A current sunk by TENV or
RENV corresponds to a maximum fall-slope of 0.7 dB/ms.
This is sufficient for a smooth envelope and also eliminates
the effect of echoes on switching behaviour.
To determine the noise level, the signals on TENV and
RENV are buffered to TNOI and RNOI. These buffers have
a maximum source current of 1
μ
A and a maximum sink
current of 120
μ
A. Together with the capacitors C
TNOI
and
C
RNOI
, the timings can be set. In the basic application
(see Fig.16) the value of both capacitors is 4.7
μ
F. At room
temperature, the 1
μ
A sourced current corresponds to a
maximum rise-slope of the noise envelope of
approximately 0.07 dB/ms.
This is small enough to track background noise and not to
be influenced by speech bursts. The 120
μ
A current that is
sunk corresponds to a maximum fall-slope of
approximately 8.5 dB/ms. However, during the decrease
of the signal envelope, the noise envelope tracks the
signal envelope so it will never fall faster than
approximately 0.7 dB/ms. The behaviour of the signal
envelope and noise envelope monitors is illustrated in
Fig.10.
Fig.9 Signal and noise envelope detectors.
handbook, full pagewidth
MGM302
LOG
4
3
2
6
7
5
LOG
from
microphone
amplifier
from
loudspeaker
amplifier
TSEN
RTSEN
CTSEN
CTENV
CTNOI
RRSEN
CRSEN
CRENV
CRNOI
TENV
TNOI
RSEN
RENV
RNOI
to logic
to logic
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