參數(shù)資料
型號(hào): TE28F640C3
廠商: Intel Corp.
英文描述: 3 Volt Intel Advanced+ Boot Block Flash Memory
中文描述: 3伏英特爾高級(jí)啟動(dòng)塊閃存
文件頁(yè)數(shù): 11/58頁(yè)
文件大?。?/td> 920K
代理商: TE28F640C3
28F004/400B3, 28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3
3UHOLPLQDU\
5
0580_03
NOTES:
1. Shaded connections indicate the upgrade address connections. Lower density devices will not have the
upper address solder balls. Routing is not recommended in this area. A
19
is the upgrade address for the
16-Mbit device. A
20
is the upgrade address for the 32-Mbit device. A
21
is the upgrade address for the 64-Mbit
device.
2. 4-Mbit density not available in
μ
BGA CSP.
Table 2, “3 Volt Advanced Boot Block Pin Descriptions” on page 6
details the usage of each device
pin.
Figure 4. x16 48-Ball Very Thin Profile Pitch BGA and
μBGA* Chip Size Package (Top View,
Ball Down)
A
13
A
14
A
15
A
16
V
CCQ
A
11
A
10
A
12
D
14
D
15
A
8
WE#
A
9
D
5
D
6
V
PP
RP#
D
11
D
12
WP#
A
20
D
2
D
3
A
19
A
17
A
6
D
8
D
9
A
7
A
5
A
3
CE#
D
0
A
4
A
2
A
1
A
0
GND
GND
D
7
D
13
D
4
V
CC
D
10
D
1
OE#
A
B
C
D
E
F
1
3
2
5
4
7
6
8
16M
32M
A
18
A
21
64M
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