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參數(shù)資料
| 型號： | TE28F160B3TC70 |
| 廠商： | INTEL CORP |
| 元件分類： | DRAM |
| 英文描述： | 3 Volt Advanced Boot Block Flash Memory |
| 中文描述： | 1M X 16 FLASH 2.7V PROM, 70 ns, PDSO48 |
| 封裝： | 12 X 20 MM, TSOP-48 |
| 文件頁數(shù)： | 11/49頁 |
| 文件大小： | 427K |
| 代理商： | TE28F160B3TC70 |
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E
SMART 3 ADVANCED BOOT BLOCK
–WORD-WIDE
11
PRELIMINARY
Table 2. 16-Mbit Smart 3 Advanced Boot Block Pin Descriptions
(Continued)
Symbol
Type
Name and Function
V
CCQ
INPUT
OUTPUT V
CC
:
Enables all outputs to be driven to 2.0V ±10% while the
V
CC
is at 2.7V. When this mode is used, the V
CC
should
be regulated to
2.7V–2.85V to achieve lowest power operation (see Section 6.1: DC
Characteristics: V
CCQ
= 1.8V–2.2V).
This input may be tied directly to V
CC
(2.7V–3.6V).
See the DC Characteristics for further details.
V
CC
DEVICE POWER SUPPLY:
2.7V–3.6V
V
PP
PROGRAM/ERASE POWER SUPPLY:
For erasing memory array
blocks or programming data in each block, a voltage of either 2.7V–3.6V
or 12V
±
5% must be applied to this pin. When V
PP
< V
PPLK
all blocks
are locked and protected against Program and Erase commands.
Applying 11.4V-12.6V to V
PP
can only be done for a maximum of 1000
cycles on the main blocks and 2500 cycles on the parameter blocks.
V
PP
may be connected to 12V for a total of 80 hours maximum (see
Section 3.4 for details).
GND
GROUND:
For all internal circuitry. All ground inputs
must
be
connected.
NC
NO CONNECT:
Pin may be driven or left floating.
2.2
Block Organization
The Smart 3 Advanced Boot Block is an
asymmetrically-blocked architecture that enables
system integration of code and data within a single
flash
device.
Each
block
independently of the others up to 10,000 times. For
the address locations of each block, see the
memory maps in Figure 5 (top boot blocking) and
Figure 6 (bottom boot blocking).
can
be
erased
2.2.1
PARAMETER BLOCKS
The Smart 3 Advanced Boot Block flash memory
architecture includes parameter blocks to facilitate
storage of frequently updated small parameters
(e.g., data that would normally be stored in an
EEPROM). By using software techniques, the word-
rewrite functionality of EEPROMs can be emulated.
Each 4-/8-/16-Mbit device contains eight parameter
blocks of 4-Kwords (4,096-words) each.
2.2.2
MAIN BLOCKS
After the parameter blocks, the remainder of the
array is divided into equal size main blocks for data
or code storage. Each 16-Mbit device contains
thirty-one 32-Kword (32,768-word) blocks. Each
8-Mbit device contains fifteen 32-Kword blocks.
Each 4-Mbit device contains seven 32-Kword
blocks.
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| TE28F400B3B110 | SMART 3 ADVANCED BOOT BLOCK 4-, 8-, 16-, 32-MBIT FLASH MEMORY FAMILY |
| TE28F800B3B120 | SMART 3 ADVANCED BOOT BLOCK WORD-WIDE |
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| TE28F160B3TC80 | 制造商:INTEL 制造商全稱:Intel Corporation 功能描述:3 Volt Advanced Boot Block Flash Memory |
| TE28F160B3TD70A | 功能描述:IC FLASH 16MBIT 70NS 48TSOP RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 標準包裝:96 系列:- 格式 - 存儲器:閃存 存儲器類型:FLASH 存儲容量:16M（2M x 8，1M x 16） 速度:70ns 接口:并聯(lián) 電源電壓:2.65 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:48-TFSOP（0.724"，18.40mm 寬） 供應商設備封裝:48-TSOP 包裝:托盤 |
| TE28F160C3 | 制造商:INTEL 制造商全稱:Intel Corporation 功能描述:3 Volt Intel Advanced+ Boot Block Flash Memory |
| TE28F160C3B110 | 制造商:INTEL 制造商全稱:Intel Corporation 功能描述:3 VOLT ADVANCED+ BOOT BLOCK 8-, 16-, 32-MBIT FLASH MEMORY FAMILY |
| TE28F160C3B90 | 制造商:INTEL 制造商全稱:Intel Corporation 功能描述:3 VOLT ADVANCED+ BOOT BLOCK 8-, 16-, 32-MBIT FLASH MEMORY FAMILY |
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