參數(shù)資料
型號(hào)： TDA9898HN/V2
廠商： NXP SEMICONDUCTORS
元件分類(lèi)： 消費(fèi)家電
英文描述： SPECIALTY CONSUMER CIRCUIT, PQCC48
封裝： 7 X 7 MM, 0.85 MM HEIGHT, PLASTIC, SOT619-1, MO-220, HVQFN-48
文件頁(yè)數(shù)： 101/103頁(yè)
文件大?。?/td> 511K
代理商： TDA9898HN/V2
TDA9897_TDA9898_3
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 03 — 11 January 2008
97 of 103
NXP Semiconductors
TDA9897; TDA9898
Multistandard hybrid IF processing
16. Soldering
16.1 Introduction
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for ne pitch
SMDs. In these situations reow soldering is recommended.
16.2 Through-hole mount packages
16.2.1 Soldering by dipping or by solder wave
Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250
°C
or 265
°C, depending on solder material applied, SnPb or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specied maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
16.2.2 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300
°C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300
°C and 400 °C, contact may be up to 5 seconds.
16.3 Surface mount packages
16.3.1 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 54) than a PbSn process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
Table 58 and 59
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TDA9898S1 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:Multistandard hybrid IF processing
TDA9898V2 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:Multistandard hybrid IF processing
TDA9899 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:Multistandard hybrid IF processing including car mobile
TDA9899HL 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:Multistandard hybrid IF processing including car mobile
TDA9899HL/V2,118 功能描述:上下轉(zhuǎn)換器 MULTI APPL SYS RoHS:否 制造商:Texas Instruments 產(chǎn)品:Down Converters 射頻:52 MHz to 78 MHz 中頻:300 MHz LO頻率: 功率增益: P1dB: 工作電源電壓:1.8 V, 3.3 V 工作電源電流:120 mA 最大功率耗散:1 W 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PQFP-128
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