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參數(shù)資料
| 型號： | TDA9874H |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 接收器 |
| 英文描述： | Digital TV sound demodulator/decoder |
| 中文描述： | AM/FM, AUDIO DEMODULATOR, PQFP44 |
| 封裝： | 14 X 14 MM, 2.20 MM HEIGHT, PLASTIC, SOT-205-1, QFP-44 |
| 文件頁數(shù)： | 52/56頁 |
| 文件大?。?/td> | 254K |
| 代理商： | TDA9874H |
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1998 Apr 27
52
Philips Semiconductors
Preliminary specification
Digital TV sound demodulator/decoder
TDA9874H
14 SOLDERING
14.1
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(order code 9398 652 90011).
14.2
Reflow soldering
Reflow soldering techniques are suitable for all QFP
packages.
The choice of heating method may be influenced by larger
plastic QFP packages (44 leads, or more). If infrared or
vapour phase heating is used and the large packages are
not absolutely dry (less than 0.1% moisture content by
weight), vaporization of the small amount of moisture in
them can cause cracking of the plastic body. For details,
refer to the Drypack information in the “Data Handbook
IC26; Integrated Circuit Packages; Section: Packing
Methods”
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 50 and 300 seconds depending on heating
method. Typical reflow peak temperatures range from
215 to 250
°
C.
14.3
Wave soldering
Wave soldering is
not
recommended for QFP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
If wave soldering cannot be avoided, for QFP
packages with a pitch (e) larger than 0.5 mm, the
following conditions must be observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.
The footprint must be at an angle of 45
°
to the board
direction and must incorporate solder thieves
downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260
°
C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150
°
C within
6 seconds. Typical dwell time is 4 seconds at 250
°
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
14.4
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300
°
C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320
°
C.
CAUTION
Wave soldering is NOT applicable for all QFP
packages with a pitch (e) equal or less than 0.5 mm.
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| TDA9875 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Digital TV Sound Processor DTVSP |
| TDA9875A | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Digital TV Sound Processor DTVSP |
| TDA9875AH | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Digital TV Sound Processor DTVSP |
| TDA9875AH/V2,557 | 功能描述:IC SOUND PROC DGTL TV 64QFP RoHS:是 類別:集成電路 (IC) >> 線性 - 音頻處理 系列:- 其它有關文件:STA321 View All Specifications 標準包裝:1 系列:Sound Terminal™ 類型:音頻處理器 應用:數(shù)字音頻 安裝類型:表面貼裝 封裝/外殼:64-LQFP 裸露焊盤 供應商設備封裝:64-LQFP EP（10x10） 包裝:Digi-Reel® 其它名稱:497-11050-6 |
| TDA9880 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Alignment-free multistandard vision and FM sound IF-PLL demodulator |
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